Physical Properties of Copper Based MMC Strengthened with Alumina

• Autorzy: Kaczmar J. W. , Granat K. , Kurzawa A. , Grodzka E.

Identyfikatory

DOI

10.2478/afe-2014-0042

• Języki publikacji: EN

Abstrakty

EN

The aim of this work is the development of Cu-Al2O3 composites of copper Cu-ETP matrix composite materials reinforced by 20 and 30 vol.% Al2O3 particles and study of some chosen physical properties. Squeeze casting technique of porous compacts with liquid copper was applied at the pressure of 110 MPa. Introduction of alumina particles into copper matrix affected on the significant increase of hardness and in the case of Cu-30 vol. % of alumina particles to 128 HBW. Electrical resistivity was strongly affected by the ceramic alumina particles and addition of 20 vol. % of particles caused diminishing of electrical conductivity to 20 S/m (34.5% IACS). Thermal conductivity tests were performed applying two methods and it was ascertained that this parameter strongly depends on the ceramic particles content, diminishing it to 100 Wm-1K-1 for the composite material containing 30 vol.% of ceramic particles comparing to 400 Wm-1K-1 for the unreinforced copper. Microstructural analysis was carried out using SEM microscopy and indicates that Al2O3 particles are homogeneously distributed in the copper matrix. EDS analysis shows remains of silicon on the surface of ceramic particles after binding agent used during preparation of ceramic preforms.

Słowa kluczowe

EN

metal matrix composite; copper; alumina particles; squeeze casting; thermal conductivity; electrical conductivity

PL

kompozyt; miedź; przewodność cieplna; przewodność elektryczna

• Wydawca: Komisja Odlewnictwa Polskiej Akademii Nauk Oddział w Katowicach
• Czasopismo: Archives of Foundry Engineering
• Rocznik: 2014
• Tom: Vol. 14, iss. 2
• Strony: 85--90
• Opis fizyczny: Bibliogr. 9 poz., rys., tab., wykr.

Twórcy

autor

Kaczmar J. W.

• Wrocław University of Technology, Faculty of Mechanical Engineering, ul. Łukasiewicza 5, 50-370 Wrocław, Poland

autor

Granat K.

• Wrocław University of Technology, Faculty of Mechanical Engineering, ul. Łukasiewicza 5, 50-370 Wrocław, Poland

autor

Kurzawa A.

• Wrocław University of Technology, Faculty of Mechanical Engineering, ul. Łukasiewicza 5, 50-370 Wrocław, Poland

autor

Grodzka E.

• Wrocław University of Technology, Faculty of Mechanical Engineering, ul. Łukasiewicza 5, 50-370 Wrocław, Poland

Bibliografia

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• [2] N. Peter Ostbo (2002). Evolution of Alpha Phase Alumina in Agglomerates upon Addition to Cryolitic Melts. PhD thesis.
• [3] Paglia G. (2004), Determination of the Structure of γ- Alumina using Empirical and First Principles Calculations Combined with Supporting Experiments. PhD thesis.
• [4] Peng Yu, Cheng-Ji Deng, Nan-Gang Ma, Man-Yan Yau & Dickon H.L. Ng. (2003). Formation of nanostructured eutectic network in α-Al2O3 reinforced Al–Cu alloy matrix composite, Acta Materialia. 51, 3445–3454.
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• [6] Katsuhito Y. & Hideaki M. (2004). Thermal properties of diamond/copper composite material. Microelectronics Reliability. Vol. 44, 303–308.
• [7] CRC Materials Science and Engineering Handbook. pp. 281-421.
• [8] Gundrum B. C., Cahill D. G. & Averback R. S. (2005) Thermal conductance of metal-metal interfaces. Physical Review B, Vol. 72, 245-426.
• [9] Jeżowski A., Stachowiak P., Plackowski T., Suski T., Krukowski S., Boćkowski M., Grzegory I., Danilchenko B. & Paszkiewicz T. (2003). Thermal conductivity of GaN crystals grown by high pressure method. Physica Status Solid. 240, pp. 447-450.