Noise properties of thin-film Ni-P resistors embedded in printed circuit boards

• Autorzy: Stadler A. W. , Zawiślak Z. , Stęplewski W. , Dziedzic A.
• Języki publikacji: EN

Abstrakty

EN

Noise studies of planar thin-film Ni-P resistors made in/on Printed Circuit Boards, both covered with two different types of cladding or uncladded have been described. The resistors have been made of the resistive-conductive-material (Ohmega-Ply©) of 100 Ώ/sq. Noise of the selected pairs of samples has been measured in the DC resistance bridge with a transformer as the first stage in a signal path. 1/f noise caused by resistance fluctuations has been found to be the main noise component. Parameters describing noise properties of the resistors have been calculated and then compared with the parameters of other previously studied thin- and thick-film resistive materials.

Słowa kluczowe

EN

thin-film resistors; Ni-P foil; 1/f noise; low-frequency noise measurements

• Wydawca: Polska Akademia Nauk, Wydział IV Nauk Technicznych
• Czasopismo: Bulletin of the Polish Academy of Sciences. Technical Sciences
• Rocznik: 2013
• Tom: Vol. 61, nr 3
• Strony: 731--735
• Opis fizyczny: Bibliogr. 8 poz., wykr., rys., tab.

Twórcy

autor

Stadler A. W.

• Department of Electronics Fundamentals, Rzeszow University of Technology, 12 Powstańcow Warszawy St., 35-959 Rzeszow, Poland

autor

Zawiślak Z.

• Department of Electronics Fundamentals, Rzeszow University of Technology, 12 Powstańcow Warszawy St., 35-959 Rzeszow, Poland

autor

Stęplewski W.

• Tele and Radio Research Institute, 11 Ratuszowa St., 03-450, Warszawa, Poland

autor

Dziedzic A.

• Faculty of Microsystem Electronics and Photonics, Wroclaw University of Technology, 11/17 Janiszewskiego St., 50-370 Wrocław, Poland

Bibliografia

• [1] www.ohmega.com (Ohmega Technologies Inc. website).
• [2] S.K. Bhattacharya and R.R. Tummala, “Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates”, J. Mater. Sci.: Mat. in Electronics 11, 253-268 (2000).
• [3] A. Dziedzic, A. Kłossowicz, P. Winiarski, K. Nitsch, T. Piasecki, G. Kozioł, and W. Stęplewski, “Chosen electrical properties and stability of passive components embedded in printed circuit boards”, Electrotechnical Review 87 (10), 39-44 (2011).
• [4] W. Stęplewski, T. Serzysko, K. Janeczek, J. Borecki, A. Dziedzic, K. Nitsch, and T. Piasecki, “Testing of electrical parameters of thin-film resistors embedded in printed circuit boards”, Electronics - Constructions, Technologies, Applications 52 (7), 124-127 (2011).
• [5] A. Kolek, Experimental Methods of Low-Frequency Noise, Publishing House of Rzeszow University of Technology, Rzeszow, 2006, (in Polish).
• [6] Test Method Standard Electronic and Electrical ComponentParts, MIL-STD-202G, 2002.
• [7] L.K.J. Vandamme and H.J. Casier, “The 1/f noise versus sheet resistance in poly-Si is similar to poly-SiGe resistors and Aulayers”, Proc 34th Eur. Solid-State Device Research Conf. 1, 21-23 (2004).
• [8] A.W. Stadler, “Noise properties of thick-film resistors in extended temperature range”, Microelectronics Reliability 51, 1264-1270 (2011).