Three-phase contact line expansion during air bubble attachment to hydrophobic solid surface – experiment and modeling

• Autorzy: Basarova P. , Soušková K. , Zawala J.

Identyfikatory

DOI

10.5277/ppmp18138

• Języki publikacji: EN

Abstrakty

EN

Kinetics of spreading of the three-phase contact hole (dewetting) formed by an air bubble colliding with hydrophobic solid surface, after rupture of intervening liquid film, was studied both experimentally and numerically. During experiments it was found that evolution of the TPC line diameter with time occurs with characteristic S-shaped trend which, in consequence, causing rather unexpected maxima at the TPC line spreading velocity curves. It was determined that position of this maximum appears after 1-2 ms after TPC hole formation and its position (in respect to time) depends on the bubble diameter. In solution of surface-active substance this maximum was much smoother and longer. By means of complementary numerical calculations the source of maxima existence and differences in their position and shapes were explained. It was concluded that this effect has only hydrodynamic origin, caused by different course of bubble shape pulsations during TPC line formation and spreading, which depends on degree of liquid/gas interface immobilization (fluidity retardation).

Słowa kluczowe

EN

Attachment; simulations; bubble; three-phase contact; dewetting

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Physicochemical Problems of Mineral Processing
• Rocznik: 2018
• Tom: Vol. 54, iss. 4
• Strony: 1095--1106
• Opis fizyczny: Bibliogr. 20 poz., rys., tab.

Twórcy

autor

Basarova P.

• University of Chemistry and Technology Prague

autor

Soušková K.

• University of Chemistry and Technology Prague

autor

Zawala J.

• Jerzy Haber Institute of Catalysis and Surface Chemistry Polish Academy of Sciences: Krakow, Poland

Bibliografia

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Uwagi

PL

Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).