Enhanced thermal conductivity of graphene nanoplatelets epoxy composites

• Autorzy: Jarosinski L. , Rybak A. , Gaska K. , Kmita G. , Porebska R. , Kapusta C.

Identyfikatory

DOI

10.1515/msp-2017-0028

• Języki publikacji: EN

Abstrakty

EN

Efficient heat dissipation from modern electronic devices is a key issue for their proper performance. An important role in the assembly of electronic devices is played by polymers, due to their simple application and easiness of processing. The thermal conductivity of pure polymers is relatively low and addition of thermally conductive particles into polymer matrix is the method to enhance the overall thermal conductivity of the composite. The aim of the presented work is to examine a possibility of increasing the thermal conductivity of the filled epoxy resin systems, applicable for electrical insulation, by the use of composites filled with graphene nanoplatelets. It is remarkable that the addition of only 4 wt.% of graphene could lead to 132 % increase in thermal conductivity. In this study, several new aspects of graphene composites such as sedimentation effects or temperature dependence of thermal conductivity have been presented. The thermal conductivity results were also compared with the newest model. The obtained results show potential for application of the graphene nanocomposites for electrical insulation with enhanced thermal conductivity. This paper also presents and discusses the unique temperature dependencies of thermal conductivity in a wide temperature range, significant for full understanding thermal transport mechanisms.

Słowa kluczowe

EN

graphene nanoplatelets; thermal conductivity; electrical resistivity; epoxy resin; high-shear exfoliation

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2017
• Tom: Vol. 35, No. 2
• Strony: 382--389
• Opis fizyczny: Bibliogr. 30 poz., rys.

Twórcy

autor

Jarosinski L.

• Department of Solid State Physics, Faculty of Physics and Applied Computer Science, AGH University of Science and Technology, Krakow, Poland

autor

Rybak A.

• ABB Corporate Research Center, Krakow, Poland

autor

Gaska K.

• Department of Solid State Physics, Faculty of Physics and Applied Computer Science, AGH University of Science and Technology, Krakow, Poland
• Department of Materials and Manufacturing Technology, High Voltage Engineering Division, Chalmers University of Technology, Gothenburg, Sweden

autor

Kmita G.

• ABB Corporate Research Center, Krakow, Poland

autor

Porebska R.

• ABB Corporate Research Center, Krakow, Poland

autor

Kapusta C.

• Department of Solid State Physics, Faculty of Physics and Applied Computer Science, AGH University of Science and Technology, Krakow, Poland

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Uwagi

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017).