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Application of interlayers in the soldering process of graphite composite to aluminium alloy 6060

Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
The paper presents a problem of joining graphite-copper composite to aluminium alloy 6060 by soldering method. This type of joints is used in electricity transmitting devices, e.g. in current receivers of rail vehicles. Therefore, the joints should show good electrical conductivity. Soldering process of graphite to aluminium directly is impossible and requires application of metallic interlayers. The problem was solved by using interlayers deposited by electroplating and low pressure cold spraying (LPCS) prior to soldering process. Various methods of substrate preparation were used. The results of shear strength and metallographic analysis were described. The highest shear strength of 17.6 MPa showed sample prepared by grit blasting and cold plasma, simultaneously.
Rocznik
Strony
91--99
Opis fizyczny
Bibliogr. 29 poz., fot., rys., wykr.
Twórcy
autor
  • Department of Materials Science, Strength and Welding, Wroclaw University of Science and Technology, Wroclaw 50370, Poland
autor
  • Department of Materials Science, Strength and Welding, Wroclaw University of Science and Technology, Wroclaw 50370, Poland
autor
  • Department of Materials Science, Strength and Welding, Wroclaw University of Science and Technology, Wroclaw 50370, Poland
autor
  • Department of Materials Science, Strength and Welding, Wroclaw University of Science and Technology, Wroclaw 50370, Poland
Bibliografia
  • [1] R. Koleňák, P. Šebo, M. Provaznik, M. Koleňakova, K. Ulrich, Shear strength and wettability of active Sn3.5Ag4Ti (Ce, Ga) solder on Al2O3 ceramics, Mater. Des. 32 (2011) 3997–4003.
  • [2] S.Y. Chang, T.H. Chuang, L.C. Tsao, C.L. Yang, Z.S. Yang, Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti (Ce, Ga) filler metal, J. Mater. Process. Technol. 202 (2008) 22–26.
  • [3] Z. Mirski, I. Ciepacz, Z. Zimniak, K. Granat, T. Wojdat, Galvanized coatings in connecting difficult-to-bond materials. Pt. 1. Influence of surface preparation on the adhesion of galvanized coatings to a non-metal substrate, Ochrona Przed Korozją 5 (2017) 166–169.
  • [4] L.C. Tsao, Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE) filler, Mater. Sci. Eng. A 565 (2013) 63–71.
  • [5] A. Rahn, The Basics of Soldering, Wiley-Interscience, New York, 1993.
  • [6] Z. Mirski, K. Granat, A. Prasałek, The diffusive barriers In copper brazing with austenitic steel by use the Cu-Ag-P (LAg15P) filler metal, Arch. Metal. Mater. 53 (2008) 1035–1046.
  • [7] Z. Mirski, T. Wojdat, M. Stachowicz, Soldering of aluminium with copper and steel using intermediate layer Zn-Ni, Arch. Civ. Mech. Eng. 15 (2015) 903–910.
  • [8] B. Wielage, A. Wank, T. Grund, Thermally sprayed solder/braze filler alloys for the joining of light metals, in: Proc. The XII Workshop Plasmatechnik, Ilmenau, 2004.
  • [9] V.K. Champagne, The Cold Spray Materials Deposition Process – Fundamentals and Applications, Woodhead Publishing Limited, Cambridge, 2007.
  • [10] R.G. Maev, V. Leshchynsky, Introduction to Low Pressure Gas Dynamic Spray, Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, 2008.
  • [11] H. Assadi, F. Gärtner, T. Stoltenhoff, H. Kreye, Bonding mechanism in cold gas spraying, Acta Mater. 51 (2003) 4379–4394.
  • [12] H. Koivuluoto, P. Vuoristo, Effect of powder type and composition on structure and mechanical properties of Cu + Al2O3 coatings prepared by using low-pressure cold spray process, J. Therm. Spray Technol. 19 (2010) 1081–1092.
  • [13] F. Gärtner, T. Stoltenhoff, J. Voyer, H. Kreye, S. Riekehr, M. Kocak, Mechanical properties of cold-sprayed and thermally sprayed copper coatings, Surf. Coat. Technol. 200 (2006) 770–782.
  • [14] H. Koivuluoto, J. Lagerbom, M. Kylmalahti, P. Vuoristo, Microstructure and mechanical properties of low-pressure cold-sprayed (LPCS) coatings, J. Therm. Spray Technol. 17 (2008) 721–727.
  • [15] H. Koivuluoto, A. Coleman, K. Murray, M. Kearns, P. Vuoristo, High pressure cold sprayed (HPCS) and low pressure cold sprayed (LPCS) coatings prepared from OFHC Cu feedstock: overview from powder characteristics to coating properties, J. Therm. Spray Technol. 21 (2012) 1065–1075.
  • [16] T. Wojdat, M. Winnicki, M. Rutkowska-Gorczyca, S. Krupiński, K. Kubica, Soldering aluminium to copper with the use of interlayers deposited by cold spraying, Arch. Civ. Mech. Eng. 16 (2016) 835–844.
  • [17] EN 573-3:2014-02. Aluminum and Aluminum Alloys – Chemical Composition and Form of Wrought Products – Part 3: Chemical Composition and Form of Products.
  • [18] F. Campbell, J.A. Frauenhofer, Some uses of pyrophosphates in metal finishing part I. Bismuth to copper-tin alloys, Surf. Technol. 4 (1976) 303–330.
  • [19] R. Wiedermann, R. Motta de Sillos, Technical Handbook. Surface Treatments, 2007, 136–138.
  • [20] Z. Gao, J. Sun, S. Peng, L. Yao, Y. Qiu, Surface modification of a polyamide 6 film by He/CF4 plasma using atmospheric pressure plasma jet, Appl. Surf. Sci. 256 (2009) 1496–1501.
  • [21] C. Mandolfino, E. Lertora, C. Gambaro, Influence of cold plasma treatment parameters on the mechanical properties of polyamide homogeneous bonded joints, Surf. Coat. Technol. 313 (2017) 222–229.
  • [22] EN ISO 3677:2016. Filler Metal for Soldering and Brazing – Designation.
  • [23] Harris Calorific International: Production Brazing Consumables & Equipment, Catalog.
  • [24] R.D. Adams, Adhesive Bonding: Science, Technology and Application, Woodhead Publishing Limited, Cambridge, 2005.
  • [25] Y. Wei-Yuan, L. Sen-Hui, L. Xin-Ya, L. Min-Pen, S. Wei-Gang, Interface reaction in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn–Ag–Ti solder foil, J. Mater. Process. Technol. 221 (2005) 285–290.
  • [26] J.L. Qi, Z.Y. Wang, J.H. Lin, T.Q. Zhang, A.T. Zhang, J. Cao, X. Li, L.X. Zhang, J.C. Feng, Graphene-enhanced Cu composite interlayer for contact reaction brazing aluminum alloy 6061, Vacuum 136 (2017) 142–145.
  • [27] D. Min, Z. Pei-Lei, Z. Zhen-Yu, Y. Shun, Direct-soldering 6061 aluminum alloys with ultrasonic coating, Ultrason. Sonochem. 17 (2010) 292–297.
  • [28] M. Velamati, E. Aguilar, M.A. Garza-Castanon, N.P. Hungc, M. Powers, Laser and resistance joining of aluminum–graphite composite, J. Mater. Process. Technol. 212 (2012) 2549–2557.
  • [29] L.C. Tsao, Interfacial structure and fracture behavior of 6061 Al and MAO-6061 Al direct active soldered with Sn–Ag–Ti active solder, Mater. Des. 56 (2014) 318–324.
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019)
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-105e4cb7-7edc-4618-ad18-e8703ced5cba
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