SPICE simulation of passive N-type guard rings in smart power ICs

• Autorzy: Buccella P. , Stefanucci C. , Sallese J.-M. , Kayal M.
• Języki publikacji: EN

Abstrakty

EN

When designing in Smart Power technologies, TCAD simulations are mandatory to design effective passive protections against parasitic couplings due to minority carriers. The objective of this paper is to propose a SPICE-based approach to characterize electrical key parameters of a passive protection directly within standard IC design flow avoiding time consuming TCAD simulations. Our approach consists in integrating a new substrate model in SPICE to enable designers to derive themselves process specific design rules and reduce substrate couplings. This methodology enables designers to access valuable results in the early stage of IC design, where before such results could be obtained only in the final verification step.

Słowa kluczowe

EN

substrate modeling; noise coupling; power parasitic modelling

PL

modelowanie substratów; sprzężenie zakłóceń; zasilanie pasożytnicze

• Wydawca: Lodz University of Technology. Department of Microelectronics and Computer Science
• Czasopismo: International Journal of Microelectronics and Computer Science
• Rocznik: 2015
• Tom: Vol. 6, nr 2
• Strony: 64--68
• Opis fizyczny: Bibliogr. 15 poz., il. kolor., wykr.

Twórcy

autor

Buccella P.

• Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland

autor

Stefanucci C.

• Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland

autor

Sallese J.-M.

• Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland

autor

Kayal M.

• Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland

Bibliografia

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