Effect of Electroless Ni–P Plating on the Bonding Strength of Bi–Te-Based Thermoelectric Modules

• Autorzy: Kim S. S. , Son I. , Kim K. T.

Identyfikatory

DOI

10.1515/amm-2017-0182

• Języki publikacji: EN

Abstrakty

EN

In the present study, electroless Ni–P plating was applied to Bi–Te-based thermoelectric materials as a barrier layer and the effect of the Ni–P plating on the bonding strength of the thermoelectric module was investigated. The bonding strength of the n- and p-type modules increased after being subjected to the electroless Ni–P plating treatment. In the case of the thermoelectric module that was not subjected to electroless Ni–P plating, Sn and Te were interdiffused and formed a brittle Sn–Te-based metallic compound. The shearing mostly occurred on the bonding interface where such an intermetallic compound was formed. On the other hands, it was found from the FE-EPMA analysis of the bonding interface of thermoelectric module subjected to electroless Ni-P plating that the electroless Ni-P plating acted as an anti-diffusion layer, preventing the interdiffusion of Sn and Te. Therefore, by forming such an anti-diffusion layer on the surface of the Bi–Te based thermoelectric element, the bonding strength of the thermoelectric module could be increased.

Słowa kluczowe

EN

thermoelectric; Ni–P plating; bonding strength; Bi–Te; soldering

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1225--1229
• Opis fizyczny: Bibliogr. 9 poz., rys.

Twórcy

autor

Kim S. S.

• School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-Gu, Daegu 702-701, Korea

autor

Son I.

• School of Materials Science and Engineering, Kyungpook National University, 80 Daehakro, Buk-Gu, Daegu 702-701, Korea

autor

Kim K. T.

• Powder & Ceramic Materials Division, Korea Institute of Materials Science, 797 Changwon-Daero, Seongsan-Gu, Changwon, Gyeongnam 642-831, Korea

Bibliografia

• [1] F. J. Disalro, Science 285, 703-706 (1999).
• [2] D. Y. Chung, T. Hogan, P. Brazis, M. Rocci-Lane, C. Kannewurf, M. Bastea, C. Uher, M.G. Kanatzidis, Science 287, 1024-1027 (2000).
• [3] K. T. Kim, S. Y. Choi, E.H. Shin, K.S. Moon, H.Y. Koo, G.G. Lee, G.H. Ha, Carbon 52, 541-549 (2013).
• [4] K. T. Kim, I. J. Son, G.H. Ha, J. Kor. Powd. Met. Inst. 20 (5), 345-349 (2013).
• [5] M. S. Park, H. Y. Koo, G.H. Ha, Y.H. Park, J. Kor. Powd. Met. Inst. 22 (4), 254-259 (2015).
• [6] H. Wada, K. Takahashi, T. Nishizaka, J. Mater. Sci. Lett. 9, 810-812 (1990).
• [7] D. Vasilevskiy, F. Roy, E. Renaud, R.A. Masut, S. Turenne, Proc. 25th Int. Conf. on Thermoelectrics, Vienna, Austria, 666-669 (2006).
• [8] T. Y. Lin, C. N. Liao, Albert T. Wu, J. Electron. Mater. 41 (1), 153-158 (2012).
• [9] S. W. Chen, C. N. Chiu, Scripta Mater. 56, 97-99 (2007).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)