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Abstrakty
AlN films on a Si substrate were synthesized by magnetron sputtering method. A dual magnetron system operating in AC mode was used in the experiment. Processes of synthesis were carried out in the atmosphere of a mixture of Ar/N2. Morphology and phase structure of the AlN films were investigated at different pressures. Structural characterizations were performed by means of SEM and X-ray diffraction methods. Our results show that the use of magnetron sputtering method in a dual magnetron sputtering system is an effective way to produce AlN layers which are characterized by a good adhesion to the silicon substrate. The morphology of the films is strongly dependent on the Ar/N2 gas mixture pressure. An increase of the mixture pressure is accompanied by a columnar growth of the layers. The films obtained at the pressure below 1 Pa are characterized by finer and compacter structure. The AlN films are characterized by a polycrystalline hexagonal (wurtzite) structure in which the crystallographic orientation depends on the gas mixture pressure.
Słowa kluczowe
Wydawca
Czasopismo
Rocznik
Tom
Strony
639--643
Opis fizyczny
Bibliogr. 26 poz., rys., tab.
Twórcy
autor
- Department of Material Physics, National Centre for Nuclear Research (NCBJ), Andrzeja Soltana 7, 05-400 Otwock-Swierk, Poland
autor
- Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141, 02-507 Warsaw, Poland
autor
- Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141, 02-507 Warsaw, Poland
autor
- Institute of Physics, Polish Academy of Sciences, al. Lotnikow 32/46, 02-668, Warsaw, Poland
autor
- Department of Material Physics, National Centre for Nuclear Research (NCBJ), Andrzeja Soltana 7, 05-400 Otwock-Swierk, Poland
Bibliografia
- [1] KAR J.P., BOSE G., TULI S., Vacuum, 81 (4) (2006), 494.
- [2] CHIU K.H., CHEN J.H., CHEN H.R., HUANG R.S., Thin Solid Films, 515 (2007), 4819.
- [3] OLIVARES J., RIVERA J., BRIONES A., Diam. Relat. Mater., 16 (2007), 1421.
- [4] JANG K., LEE K., KIM J., HWANG S., LEE J., DHUNGEL S.K., JUNG S., YI J., Mat. Sci. Semicon. Proc., 9 (2006), 1137.
- [5] PRINZ G.M., LADENBURGER A., FENEBERG M., SCHIRRA M., THAPA S.B., BICKERMANN M., EPELBAUM B.M., SCHOLZ F., THONKE K., SAUER R., Superlattice. Microst., 40 (2006), 513.
- [6] DUBOIS M.A., MURALT P., Appl. Phys. Lett., 74 (1999), 3032.
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- [19] HWANG B.-H., CHEN C.-S., LU H.-Y., HSU T.-C., Mat. Sci. Eng. A-Struct., 325 (2002), 380.
- [20] KAMOHARA T., AKIYAMA M., UENO N., NONAKA K., TATEYAMA H., J. Cryst. Growth, 275 (2005), 383.
- [21] POSADOWSKI W., WIATROWSKI A., DORA J., RADZI´NSKI Z., Thin Solid Films, 516 (14) (2008), 4478.
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- [23] RODRIGUEZ-CARVAJAL J., Comm. Powder Diffr. Newsl., 26 (2001), 12.
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- [25] GOLDBERG Y., Aluminum Nitride (AlN), in: LEVINSHTEIN M.E., RUMYANTSEV S.L., SHUR M.S. (Eds.), Properties of Advanced Semiconductor Materials GaN, AlN, InN, BN, SiC, SiGe, John Wiley & Sons, Inc., New York, 2001.
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Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-0b381341-efad-4572-97ce-cccb7801b642