PL EN


Preferencje help
Widoczny [Schowaj] Abstrakt
Liczba wyników
Tytuł artykułu

Structure of AlN films deposited by magnetron sputtering method

Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
AlN films on a Si substrate were synthesized by magnetron sputtering method. A dual magnetron system operating in AC mode was used in the experiment. Processes of synthesis were carried out in the atmosphere of a mixture of Ar/N2. Morphology and phase structure of the AlN films were investigated at different pressures. Structural characterizations were performed by means of SEM and X-ray diffraction methods. Our results show that the use of magnetron sputtering method in a dual magnetron sputtering system is an effective way to produce AlN layers which are characterized by a good adhesion to the silicon substrate. The morphology of the films is strongly dependent on the Ar/N2 gas mixture pressure. An increase of the mixture pressure is accompanied by a columnar growth of the layers. The films obtained at the pressure below 1 Pa are characterized by finer and compacter structure. The AlN films are characterized by a polycrystalline hexagonal (wurtzite) structure in which the crystallographic orientation depends on the gas mixture pressure.
Wydawca
Rocznik
Strony
639--643
Opis fizyczny
Bibliogr. 26 poz., rys., tab.
Twórcy
  • Department of Material Physics, National Centre for Nuclear Research (NCBJ), Andrzeja Soltana 7, 05-400 Otwock-Swierk, Poland
autor
  • Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141, 02-507 Warsaw, Poland
autor
  • Faculty of Materials Science and Engineering, Warsaw University of Technology, Woloska 141, 02-507 Warsaw, Poland
autor
  • Institute of Physics, Polish Academy of Sciences, al. Lotnikow 32/46, 02-668, Warsaw, Poland
autor
  • Department of Material Physics, National Centre for Nuclear Research (NCBJ), Andrzeja Soltana 7, 05-400 Otwock-Swierk, Poland
Bibliografia
  • [1] KAR J.P., BOSE G., TULI S., Vacuum, 81 (4) (2006), 494.
  • [2] CHIU K.H., CHEN J.H., CHEN H.R., HUANG R.S., Thin Solid Films, 515 (2007), 4819.
  • [3] OLIVARES J., RIVERA J., BRIONES A., Diam. Relat. Mater., 16 (2007), 1421.
  • [4] JANG K., LEE K., KIM J., HWANG S., LEE J., DHUNGEL S.K., JUNG S., YI J., Mat. Sci. Semicon. Proc., 9 (2006), 1137.
  • [5] PRINZ G.M., LADENBURGER A., FENEBERG M., SCHIRRA M., THAPA S.B., BICKERMANN M., EPELBAUM B.M., SCHOLZ F., THONKE K., SAUER R., Superlattice. Microst., 40 (2006), 513.
  • [6] DUBOIS M.A., MURALT P., Appl. Phys. Lett., 74 (1999), 3032.
  • [7] LOEBL H.P., KLEE M., METZMACHER C., BRAND W., MILSOM R., LOK P., Mater. Chem. Phys., 79 (2003), 143.
  • [8] DIMITROVAV., MANOVA D., PASKOVA T., UZUNOV T., IVANOV N., DECHEV D., Vacuum, 51 (1998), 161.
  • [9] MANOVA D., DIMITROVA V., FUKAREK W., KARPUZOV D., Surf. Coat. Tech., 106 (1998), 205.
  • [10] STEVENS K.S., OHTANI A., KINNIBURGH M., BERESFORD R., Appl. Phys. Lett., 65 (1994), 321.
  • [11] YOSHIDA S., MISAWA S., FUJII Y., TAKADA S., HATAKAWA H., GONDA S., ITOH A., J. Vac. Sci. Technol., 16 (1979), 990.
  • [12] OKAMOTO M., YAMAOKA M., YAP Y.K., YOSHIMURA M., MORI Y., SASAKI T., Diam. Relat. Mater., 9 (2000), 516.
  • [13] NORTON M.G., KOTULA P.G., CARTER C.B., J. Appl. Phys., 70 (1991), 2671.
  • [14] VISPUTE R., Thin Solid Films, 299 (1997), 94.
  • [15] OKANO H., TAKAHASHI Y., TANAKA T., SHIBATA K., NAKANO S., Jpn. J. Appl. Phys., 31 (1992), 3446.
  • [16] CHENG C.C., CHEN Y.C., WANG H.J., CHEN W.R., J. Vac. Sci. Technol. A, 14 (1996), 2238.
  • [17] NAIK R.S., REIF R., LUTSKY J.J., SODINI C.G., J. Electrochem. Soc., 146 (1999), 691.
  • [18] OHUCHI S., RUSSEL P.E., J. Vac. Sci. Technol. A, 5 (1987), 1630.
  • [19] HWANG B.-H., CHEN C.-S., LU H.-Y., HSU T.-C., Mat. Sci. Eng. A-Struct., 325 (2002), 380.
  • [20] KAMOHARA T., AKIYAMA M., UENO N., NONAKA K., TATEYAMA H., J. Cryst. Growth, 275 (2005), 383.
  • [21] POSADOWSKI W., WIATROWSKI A., DORA J., RADZI´NSKI Z., Thin Solid Films, 516 (14) (2008), 4478.
  • [22] BAIL LE A., DUROY H., FOURQUET J.L., Mat. Res. Bull., 23, (1988), 447.
  • [23] RODRIGUEZ-CARVAJAL J., Comm. Powder Diffr. Newsl., 26 (2001), 12.
  • [24] THORNTON J.A., J. Vac. Sci. Technol., 4 (1974), 666.
  • [25] GOLDBERG Y., Aluminum Nitride (AlN), in: LEVINSHTEIN M.E., RUMYANTSEV S.L., SHUR M.S. (Eds.), Properties of Advanced Semiconductor Materials GaN, AlN, InN, BN, SiC, SiGe, John Wiley & Sons, Inc., New York, 2001.
  • [26] PASZKOWICZ W., PODSIADLO S., MINIKAYEV R., J. Alloy. Compd., 382 (2004), 100.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-0b381341-efad-4572-97ce-cccb7801b642
JavaScript jest wyłączony w Twojej przeglądarce internetowej. Włącz go, a następnie odśwież stronę, aby móc w pełni z niej korzystać.