PL EN


Preferencje help
Widoczny [Schowaj] Abstrakt
Liczba wyników
Tytuł artykułu

Modeling of mechanical influence of double-beam laser on single-crystalline silicon

Treść / Zawartość
Identyfikatory
Warianty tytułu
PL
Modelowanie mechanicznego wpływu podwójnej wiązki laserowej na krystaliczny krzem
Konferencja
Composites and Ceramic Materials - Technology, Application and Testing (13 ; 13-15.05.2013 ; Białowieża, Poland)
Języki publikacji
EN
Abstrakty
EN
The results of finite-element modeling of controlled laser thermosplitting of crystalline silicon are presented. The case of treatment by two laser beam with wavelengths, namely 0.808 μm and 1.06 μm is studied. Calculations of the thermoelastic fields formed in a single-crystalline silicon wafer as a result of consecutive two-beam laser heating and action of coolant were performed for silicon crystalline orientations: (100), (110), (111). Modeling was performed for circular and U-shaped laser beams. The results received in the presented work, can be used for the process optimization concerning the precise separation of silicon wafers by laser cutting.
PL
W pracy przedstawiono wyniki modelowania metoda elementów skonczonych termorozszczepiania krystalicznego krzemu przy pomocy wiazek laserowych. Analizowano przypadek działania dwóch wiazek laserowych o długosci fali 0,808 μm i 1,06 μm. Obliczenia pól termosprężystych, formowanych w krystalicznym waflu krystalicznym, prowadzono jako efekt kolejnych działan dwuwiązkowego ogrzewania laserowego i chłodzenia dla orientacji (100), (110), (111) krystalicznego krzemu. Modelowanie prowadzone było dla wiązek o przekroju kolistym oraz w kształcie litery U. Otrzymane wyniki mogą być wykorzystane do optymalizacji precyzyjnego cięcia laserem wafli krzemowych.
Twórcy
  • Department of Physics “Gomel State University by F. Skorina”, Sovetskaya 104, 246019 Gomel, Belarus
  • Department of Physics “Gomel State University by F. Skorina”, Sovetskaya 104, 246019 Gomel, Belarus
  • Educational Establishment "Belarusian Trade and Economics University of Consumer Cooperatives", Gomel
  • Institute of Fundamental Technological Reasearch Polish Academy of Sciences, 5b Pawińskiego, 02-106 Warszawa, Poland
  • Department of Physics “Gomel State University by F. Skorina”, Sovetskaya 104, 246019 Gomel, Belarus
autor
  • Department of Physics “Gomel State University by F. Skorina”, Sovetskaya 104, 246019 Gomel, Belarus
Bibliografia
  • [1] A. S. Naumov, Development of division technology of instrument wafers on crystals, author’s abstract of Ph. D. of Physics dissertation: 05.11.14, MSUPI, 2009.
  • [2] P. D. Gindin, Development of new technologies and the equipment on basis ofalaser controlled thermosplitting method for treatment of instrument making parts, micro- and optoelectronics, author’s abstract of Doctor of Physics dissertation: 05.11.14, MSUPI, 2009.
  • [3] A. N. Serdyukov, S. V. Shalupaev, Yu.V. Nikitjuk, Features of Controlled Laser Therm Cleavage of Crystalline Silicon, Crystallography Reports 55(6), 933-937 (2010).
  • [4] A. N. Serdyukov, E. B. Shershnev, S. V. Shalupaev, Yu. V. Nikitjuk, V. F. Sholokh, S. I. Sokolov, Features of Controlled Laser Thermal Cleavage of Crystal Quartz, Crystallography Reports 57(6), 792-797 (2012)
  • [5] V. S. Kondrateno, The method of cutting of nonmetallic materials, Patent 2024441, Russian federation, 1994.
  • [6] A. V. Fedin, Effect ofapulling of radiation CO2-laser in the narrow channel at metals treatment by the combined laser radiation, Proceedings RAC. S. Physics 63(10), 2053-2058 (1999).
  • [7] S. V. Shalupaev, E. B. Shershnev, Yu. V. Nikitjuk, A. A. Sereda, Two-beam laser thermal cleavage of brittle nonmetallic materials, J. Opt. Technol 73(5), 356-359 (2006).
  • [8] S. V. Shalupaev, A. V. Maksimenko, V. N. Mishkovets, Yu. V. Nikitjuk, Laser cutting of ceramics materials with metallized surface, J. Opt. Technol 68(10), 758-760 (2001).
  • [9] J. Junke, W. Xinbing, Cutting glass substrates with dual-laser beams, Optics and Lasers in Engineering 47, 860-864 (2009).
  • [10] V. K. Sisoev, P. A. Vyatlev, A. V. Chirkov, V. A. Grozin, D. A. Konyaschenko, The concept of two-laser glass elements thermosplitting for spacecrafts, BULLETIN S.A. Lavoshkina PSUI CIA 1, 38-44 (2011).
  • [11] S. V. Shalupaev, A. V. Semchenko, Yu.V. Nikityuk, Silica gel glasses after laser radiation, Material Science 21(4), 495-501 (2003).
  • [12] S. V. Shalupaev, Yu. V. Nikityuk, A. A. Sereda, Laser thermal cleavage of brittle nonmetallic materials along closed curvilinear contours, J. Opt. Technol 75(2), 75-78 (2008).
  • [13] S. V. Shalupaev, M. Aleksiejuk, Y. V. Nikitjuk, A. A. Sereda, A. S. Pobiyaha, Laser thermosplitting of ceramic-metal sandwich-like structures with acoustical surveillance of microcrack propagation, Archives of Metallurgy and Materials 54(4), 963-968 (2009).
  • [14] J. Liu, J. Lu, X. Ni, G. Dai, L. Zhang, Y. Chen, Numerical study on thermal stress cutting of silicon wafer using two-point pulsed laser, Optica Applicata 41(1), 247-255 (2011).
  • [15] A. F. Konstantinova, B. N. Grechushnikov, B. V. Bokut, E. G. Valyashko, Optical properties of crystals, Minsk, Navukaitehnika, 1995.
  • [16] S. V. Shalupaev, M. Aleksiejuk, Y. V. Nikitjuk, A. A. Sereda, The analysis of laser thermosplitting of materials by using special geometry beams, Archives of Metallurgy and Materials 56(4), 1149-1155 (2011).
  • [17] N. N. Shabrov, Final element method in calculations of thermal engines parts, Leningrad, Mashinostroenie, 1983.
  • [18] G. P. Karzov, B. Z. Margolin, V. A. Shevtsova, Physical-mechanical modeling of destruction processes, S-Petersburg, Politehnika, 1993.
  • [19] E. S. Falkevih, Technology of semiconductor silicon, Moscow, Metallurgiya, 1992.
  • [20] Yu. V. Koritskij, Reference book on electrotechnical materials, Leningrad, Energoatomizdat, 1988.
  • [21] T. Lackner, Determination of axisymmetric elastic constants in anisotropic silicon forathyristor tablet, Journal of Electronic Materials 18, 19-24 (1989).
  • [22] A. N. Serdyukov, S. V. Shalupaev, Yu. V. Nikityuk, A. A. Sereda, Process research of laser splitting of silicon wafers, cutout in the plane (110), Problems of physics, Mathematics and Technics 3(12), 37-40 (2012).
  • [23] A. A. Blistanov, Acoustical crystals, Moscow, Nauka, 1982.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-0910d215-0fc2-453c-a3b2-f55f242dc09e
JavaScript jest wyłączony w Twojej przeglądarce internetowej. Włącz go, a następnie odśwież stronę, aby móc w pełni z niej korzystać.