Department of Integrated Circuits' and Systems' Design

• Autorzy: Janczyk G.
• Języki publikacji: EN

Słowa kluczowe

EN

Institute of Electron Technology; scientific activity

PL

Instytut Technologii Elektronowej; działalność naukowo-badawcza

• Wydawca: Instytut Technologii Elektronowej
• Czasopismo: Prace Instytutu Technologii Elektronowej
• Rocznik: 2014
• Tom: z. 1/2
• Strony: 152--178
• Opis fizyczny: Bibliogr. 42 poz., il, wykr.

Twórcy

autor

Janczyk G.

• Institute of Electron Technology, Al. Lotników 32/46, 02-668 Warsaw, Poland

Bibliografia

• Publications’2013
• [P1] BIENIEK T., JANCZYK G., DOBROWOLSKI R., SZMIGIEL D., EKWIŃSKA M., GRABIEC P., JANUS P., ZAJĄC J.: Dedicated MEMS-Based Test Structure for 3D SiP Interconnects Reliability Investigation. Proc. of the 2013 IEEE Int. 3D Systems Integration Conf. San Francisco, USA, 2-4.10.2013, p. 276-279.
• [P2] BIENIEK T., JANCZYK G., JANUS P., EKWIŃSKA M., SZMIGIEL D., DOMAŃSKI K., GRABIEC P., DUMANIA P.: Efficient Scenarios, Methodology and Tools for MEMS/NEMS Product Development. Proc. of the 10th Int. Conf. on Multi-Material Micro Manufacture. San Sebastian, Spain, 8-10.10.2013, p. 284-287.
• [P3] BIENIEK T., JANCZYK G., JANUS P., GRABIEC P., NIEPRZECKI M., WIELGOSZEWSKI G., MOCZAŁA M., GOTSZALK T., BUITRAGO E., BADIA M. F., IONESCU A. M.: Silicon Nanowires Reliability and Robustness Investigation Using AFM-Based Techniques. Electron Technology Conf. 2013 [in] Proc. of SPIE 2013 vol. 8902 p. 8902L-1-2.
• [P4] BIENIEK T., JANCZYK G., MARCHEWKA M., EKWIŃSKA M., WĄSOWSKI J., GRABIEC P.: Novel Methodology of MEMS-IC Co-Simulation in Smart Systems Development Process. Smart System Integration 2014 – Proc. Vienna, Austria, 26-27.03.2014 (submit. to print.).
• [P5] JANCZYK G., BIENIEK T., DUMANIA P., WYMYSŁOWSKI A.: Development of Multiscale, Multicriteria Optimization of SiP Design Methods. Proc. of the 10th Int. Conf. on Multi-Material Micro Manufacture. San Sebastian, Spain, 8-10.10.2013, p. 1-6.
• [P6] JANCZYK G., BIENIEK T., WĄSOWSKI J., GRABIEC P.: Investigation on Reliability of Interconnects in 3D Heterogeneous System by Ageing Beam Resonance Method. Microelectron. J. (submit. to print).
• [P7] JANCZYK G., BIENIEK T., WĄSOWSKI J., GRABIEC P.: Investigation on Reliability of Interconnects in 3D Heterogeneous System by Ageing Beam Resonance Method. TechConnect World 2013 Proc.: Nanotech, Microtech, Biotech, Cleantech. Washington, USA, 12-16.06.2013, p. 216-217.
• [P8] JAROSZ A.: Results of Design of Analog Standard Cells in 0.18 um Technology. Two Days Workshop on Cognitive Radio, European Project Par4CR. Kista, Sweden, 18-19.06.2013, p. 40-43.
• [P9] JAROSZ A.: Research Carried Out in ITE in the Area of VLSI Circuit Design in Terms of Its Usefulness in the HeC Project. 6. Sci. Conf. „Radioelectronic Devices and Systems”. Jachranka, Poland, 24-25.10.2013, WAT, p. 1-13.
• [P10] KOCIUBIŃSKI A., BIENIEK T., JANCZYK G.: Design, Modeling and Simulation of MEMS Devices on Si, SiC and Diamond for Harsh Environment Applications. Acta Phys. Pol. A (submit. to print.).
• [P11] KOŁACIŃSKI C., OBRĘBSKI D.: Design of CMOS Analog Integrated Readout Circuit for NMOS THz Detectors. Proc. of the 20th Int. Conf. Mixed Design of Integrated Circuits and Systems. Gdynia, Poland, 20-22.06.2013, p. 222-228.
• [P12] OBRĘBSKI D., SZYMAŃSKI A., TOMASZEWSKI D., GRODNER M., MARCZEWSKI J., PIECZYŃSKI J.: Development of Ionizing Radiation Detectors Integrated with Readout Electronics. Proc. of the 20th Int. Conf. Mixed Design of Integrated Circuits and Systems. Gdynia, Poland, 20-22.06.2013, p. 229-234.
• [P13] ORTLOF D., SCHMIDT T., HAHN K., BIENIEK T., JANCZYK G., BRUCK R.: MEMS Product Engineering. Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development (submit. to print).
• Conferences’2013
• [C1] BIENIEK T., JANCZYK G.: WP1 Task 1.4.x. Techn. Meet. eBrains. Munich, Germany, 22-23.01.2013 (commun.).
• [C2] BIENIEK T., JANCZYK G.: WP1 Task 1.4.x. Techn. Meet. – eBrains. Clamart, France, 24-27.04.2013 (commun.).
• [C3] BIENIEK T., JANCZYK G.: WP1 Task 1.4.x. Techn. Meet. – eBrains. Turin, Italy, 13-14.08.2013 (commun.).
• [C4] BIENIEK T., JANCZYK G., DOBROWOLSKI R., SZMIGIEL D., EKWIŃSKA M., GRABIEC P., JANUS P., ZAJĄC J.: Dedicated MEMS-Based Test Structure for 3D SiP Interconnects Reliability Investigation. IEEE Int. 3D Systems Integration Conf. San Francisco, USA, 2-4.10.2013 (poster).
• [C5] BIENIEK T., JANCZYK G., GRABIEC P.: e-BRAINS Project - European Activities in Heterogeneous Sensor Integration. 7th Int. Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (paper, poster).
• [C6] BIENIEK T., JANCZYK G., JANUS P., EKWIŃSKA M., SZMIGIEL D., DOMAŃSKI K., GRABIEC P., DUMANIA P.: Efficient Scenarios, Methodology and Tools for MEMS/NEMS Product Development. 10th Int. Conf. on Multi-Material Micro Manufacture. San Sebastian, Spain, 8-10.10.2013 (paper).
• [C7] BIENIEK T., JANCZYK G., JANUS P., GRABIEC P., NIEPRZECKI M., WIELGOSZEWSKI G., MOCZAŁA M., GOTSZALK T., BUITRAGO E., BUIU O., IONESCU A. M.: Silicon Nanowires Reliability and Robustness Investigation Using AFM-Based Techniques. XI Sci. Conf. "Electron Technology". Ryn, Poland, 16-20.04.2013 (poster).
• [C8] BIENIEK T., JANCZYK G., JANUS P., GRABIEC P., BUITRAGO E., BADIA M. F., IONESCU A. M., WIELGOSZEWSKI G., MOCZAŁA M., GOTSZALK T.: Reliability and Robustness Investigation of 3D Vertically Stacked Silicon Nanowire Structures Using AFM Based Techniques. TechConnect World 2013 Nanotech, Microtech, Biotech, Cleantech. Washington, USA, 12-16.05.2013 (poster).
• [C9] BIENIEK T., JANCZYK G., JANUS P., GRABIEC P., NIEPRZECKI M., WIELGOSZEWSKI G., MOCZAŁA M., GOTSZALK T., BUITRAGO E., BADIA M. F., IONESCU A. M., KRAEH CH., POPESCU A.: Reliability and Robustness Investigation of Novel Nanosensor Structures Using AFM-Based Techniques. 7th Int Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (paper).
• [C10] EKWIŃSKA M., BIENIEK T., JANCZYK G., KOWALSKI P., GRABIEC P., DOBROWOLSKI R.: Design, Modeling and Simulation of Specialized MEMS Microphone for Industrial Application. 8th Int. Conf. "New Electrical and Electronic Technologies and Their Industrial Implementation". Zakopane, Poland, 18-21.06.2013 (poster).
• [C11] GUZIEWICZ M., ŁASZCZ A., DOMAGAŁA J., GOŁASZEWSKA-MALEC K., CZERWIŃSKI A., SŁYSZ W.: Advantage of NbTiN over NbN in Superconducting Properties of Ultra-Thin Films. AVS 60th Int. Symp. a. Exh. Los Angeles/Long Beach, USA, 27.10.2013
• [C12] JANCZYK G., BIENIEK T.: WP1 Task 1.3.1, 1.3.3 FhG-IIS-EAS, ITE, IFX, IFAG. Techn. Meet. – eBrains. Munich, Germany, 22-23.01.2013 (commun.)
• [C13] JANCZYK G., BIENIEK T.: WP1 Task 1.3.1 & 1.3.3. Techn. Meet. – eBrains. Clamart, France, 24-27.04.2013 (commun.).
• [C14] JANCZYK G., BIENIEK T.: WP1 Task 1.3.1 & 1.3.3. Techn. Meet. – eBrains. Turin, Italy, 13-14.08.2013 (commun.).
• [C15] JANCZYK G., BIENIEK T.: WP-2-3-4-5-6 Bullet Point WP by ITE&WRUT (Common Contribution). Techn. Meet. – Parsimo. Noisy le Grand, France, 27-28.03.2013 (commun.).
• [C16] JANCZYK G., BIENIEK T.: WP2 - Outline of M18-M24 Progress. Parsimo Rev. Meet. M24. Brussels, Belgium, 24-25.06.2013 (commun.).
• [C17] JANCZYK G., BIENIEK T.: Dedicated System Including MEMS-Based and ASIC Test Structures for 3D SiP Interconnects Reliability and Robustness Investigation. 7th Int. Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (paper).
• [C18] JANCZYK G., BIENIEK T.: Work Progress for Period M27-M31 by ITE. Techn. Meet. PARSIMO. Cambridge Shire, Great Britain, 4-7.11.2013 (commun.).
• [C19] JANCZYK G., BIENIEK T., DOBROWOLSKI R., SZMIGIEL D., EKWIŃSKA M., GRABIEC P., JANUS P., ZAJĄC J.: Dedicated System Including MEMS-Based and ASIC Test Structures for 3D SiP Interconnects Reliability and Robustness Investigation (e-BRAINS Project). 7th Int. Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (poster).
• [C20] JANCZYK G., BIENIEK T., DUMANIA P., WYMYSŁOWSKI A.: Development of Multiscale, Multicriteria Optimization of SiP Design Methods 10th Int. Conf. on Multi-Material Micro Manufacture. San Sebastian, Spain, 8-10.10.2013 (paper).
• [C21] JANCZYK G., BIENIEK T., WYMYSŁOWSKI A., ŚWIECZYŃSKI R.: PARSIMO Project – European Activities in System in Package Development. 7th Int. Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (poster).
• [C22] JANCZYK G., EKWIŃSKA M., BIENIEK T., JANUS P.: ITE Contribution for WP123467. 12M SMAC Rev. Meet. Catania, Italy, 15-16.01.2013 (commun.).
• [C23] JANCZYK G., EKWIŃSKA M., BIENIEK T.: SMAC Project - SMArt Systems Co-Design 7th Int. Forum on Innovative Technologies for Medicine. Białystok, Poland, 5-7.12.2013 (poster).
• [C24] JAROSZ A.: Results of Design of Analog Standard Cells in 0.18 um Technology. Two Days Workshop on Cognitive Radio European Project Par4CR. Kista, Sweden, 18-19.06.2013 (paper).
• [C25] JAROSZ A.: Research Carried Out in ITE in the Area of VLSI Circuit Design in Terms of Its Usefulness in the HeC Project. 6. Sci. Conf. „Radioelectronic Devices and Systems”. Jachranka, Poland, 24-25.10.2013 (paper, in Polish).
• [C26] KOCIUBIŃSKI A., BIENIEK T., JANCZYK G.: Design, Modeling and Simulation of MEMS Devices on Si, SiC and Diamond for Harsh Environment Applications. 8th Int. Conf. "New Electrical and Electronic Technologies and Their Industrial Implementation". Zakopane, Poland, 18-21.06.2013 (poster).
• [C27] KOŁACIŃSKI C., OBRĘBSKI D.: Design of CMOS Analog Integrated Readout Circuit for NMOS THz Detectors. 20th Int. Conf. Mixed Design of Integrated Circuits and Systems. Gdynia, Poland, 20-22.06.2013 (paper).
• [C28] OBRĘBSKI D., SZYMAŃSKI A., TOMASZEWSKI D., GRODNER M., MARCZEWSKI J., PIECZYŃSKI J.: Development of Ionizing Radiation Detectors Integrated with Readout Electronics. Int. Conf. Mixed Design of Integrated Circuits and Systems. Gdynia, Poland, 20-22.06.2013 (paper).
• [C29] WIELGOSZEWSKI G., MOCZAŁA M., KOPIEC D., GOTSZALK T., BIENIEK T., JANCZYK G., JANUS P., GRABIEC P., KRAEH CH., POPESCU A.: Estimation of the Elastic Modulus of Polycrystalline-Silicon Microrods Using AFM-Based Techniques 39th Int. Conf. on Micro and Nano Eng. London, Great Britain, 19.09.2013 (poster).