Trends in hybrid pixel detectors for X-ray imaging using deep submicron VLSI technology

• Autorzy: Drozd A. , Satława T.
• Języki publikacji: EN

Abstrakty

EN

The article covers the latest developments in pixel detectors used for X-ray imaging as well as the description of the practical solution – a multichannel integrated circuit dedicated to X-ray imaging. In general introduction a wide range of pixel detector applications is presented. The main part focuses on the challenges and new solutions for the field of X-ray imaging, including 3D integration, silicon-on-insulator and submicron technologies. Since minimization of a pixel size together with implementing more functionality are important issues in the detectors’ and integrated circuits’ design, the aspects of channel-to-channel uniformity and additional effects like charge sharing between pixels are taken into consideration. In the last section, the Authors present the application specific integrated circuit designed in 40 nm technology dedicated to X-ray detection and future prospects are discussed.

Słowa kluczowe

EN

X-ray imaging; hybrid pixel detectors; 3D technologies; SOI technologies

PL

obrazowanie rentgenowskie; hybrydowe detektory pikseli; technologie 3D; technologia SOI

• Wydawca: Foundation for Young Scientists
• Czasopismo: Challenges of Modern Technology
• Rocznik: 2014
• Tom: Vol. 5, no. 4
• Strony: 3--7
• Opis fizyczny: Bibliogr. 12 poz., rys., wykr.

Twórcy

autor

Drozd A.

• AGH University of Science and Technology, Faculty of Electrical Engineering, Automatics, Computer Science and Biomedical Engineering, Department of Measurement and Electronics, Al. A. Mickiewicza 30, 30-059 Krakow

autor

Satława T.

• AGH University of Science and Technology, Faculty of Electrical Engineering, Automatics, Computer Science and Biomedical Engineering, Department of Measurement and Electronics, Al. A. Mickiewicza 30, 30-059 Krakow

Bibliografia

• 1. Rossi L., Fischer P., Rohe T., Wermes N.: Pixel Detectors from fundamentals to applications, Springer-Verlag Berlin Heidelberg, 2010
• 2. Sadrozinski H.: Particle detector applications in medicine, Nuclear Instruments and Methods in Physics Research A 732, 2013, pp. 34–39
• 3. Perenzoni M., Stoppa D., Malfatti M., Simoni A.: A Multispectral Analog Photon-Counting Readout Circuit for X-ray Hybrid Pixel Detectors, IEEE Transactions on Instrumentation and Measurement, Vol. 57, No. 7, Jul. 2008
• 4. Deptuch, G., Demarteau, M., Hoff, J., Lipton, R., Shenai, A., Yarema, R.., Zimmerman, T.: Pixel detectors in 3D technologies for high energy physics, 3D Systems Integration Conference (3DIC), 2010 IEEE International
• 5. Deptuch, G., et al.: Design and Tests of the Vertically Integrated Photon Imaging Chip, IEEE Transactions on Nuclear Science, Vol.61, Issue 1, Feb. 2014, pp. 663 - 674
• 6. Topol, A.W., et al.: Three-dimensional integrated circuits, Vol. 50, Issue 4.5, July 2006, pp. 491–506
• 7. Miyoshi, T.: Recent progress in development of SOI pixel detectors, Nuclear Science Symposium Conference Record (NSS/MIC), 2010 IEEE
• 8. Otfinowski P., Grybos P.: Flash ADCs for multichannel integrated systems in submicron technology, Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE
• 9. Maj P., Drozd A., Szczygiel R., Grybos P.: FPGA Simulations of Charge Sharing Effect Compensation Algorithms for Implementation in Deep Sub-Micron Technologies, IEEE 15th International Conference on Computer Modelling and Simu lation (UKSim), pp. 780 - 786, Cambridge, 2013
• 10. Gimenez, E.N et al.: Characterization of Medipix3 With Synchrotron Radiation, Nuclear Science, IEEE Transactions on (Volume:58 , Issue: 1 ),
• 11. Maj P., Grybos P., Szczygiel R., Kmon P., Drozd A., Deptuch G.: A Pixel Readout Chip in 40 nm CMOS Process for High Count Rate Imaging Systems with Minimization of Charge Sharing Effects, Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2013 IEEE, pp. 1 – 5
• 12. Maj P., et al.: Tests of the First Three-Dimensionally Integrated Chip for Photon Science, The 21st International Workshop on Vertex Detectors, Jeju, Korea, September 2012