Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

• Autorzy: Nagy E. , Kristaly F. , Gyenes A. , Gacsi Z.

Identyfikatory

DOI

10.1515/amm-2015-0163

Warianty tytułu

PL

Badanie związków międzymetalicznych w bezołowiowych stopach lutowniczych Sn-Cu-Ni

• Języki publikacji: EN

Abstrakty

EN

Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical strength of the solder joint. In the soldering process of Sn-Cu alloys, Cu₆Sn₅ intermetallic compounds are formed. The complex structural behaviour of Cu₆Sn₅ IMC is temperature- and composition-dependent and it is long since subject to scientific research. The Cu₆Sn₅ phase basically exists in two crystal structures: hexagonal η-Cu₆Sn₅ (at temperatures above 186°C) and monoclinic η’-Cu₆Sn₅ (at lower temperatures). In the presence of Ni in the solder, the η-η’ transformation does not occur, therefore, the η-Cu₆Sn₅ phase remains stable. In this study the role of Ni in the (Cu,Ni)₆Sn₅ intermetallic compound in Sn-Cu lead-free solders was examined. Sn-Cu alloys with different Cu content (0.5 to 1 mass%) were modified through Ni addition. The morphology of the intermetallic compounds of the modified Sn-Cu alloys was investigated by optical microscopy (OM) and scanning electron microscopy (SEM), the IMC phases were examined with X-ray diffraction method (XRD).

Słowa kluczowe

EN

intermetallic; lead-free solder; X-ray diffraction

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2015
• Tom: Vol. 60, iss. 2B
• Strony: 1511--1515
• Opis fizyczny: Bibliogr. 17 poz., rys.

Twórcy

autor

Nagy E.

• MTA-ME Materials Science Research Group, University of Miskolc, H-3515 Miskolc-Egyetemvaros, Hungary

autor

Kristaly F.

• Institute of Mineralogy and Geology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, Hungary

autor

Gyenes A.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, Hungary

autor

Gacsi Z.

• Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, Hungary

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