Influence of Material Coating on the Heat Transfer in a Layered Cu-SiC-Cu Systems

• Autorzy: Strojny-Nędza A. , Pietrzak K. , Teodorczyk M. , Basista M. , Węglewski W. , Chmielewski M.

Identyfikatory

DOI

10.1515/amm-2017-0199

• Języki publikacji: EN

Abstrakty

EN

This paper describes the process of obtaining Cu-SiC-Cu systems by way of spark plasma sintering. A monocrystalline form of silicon carbide (6H-SiC type) was applied in the experiment. Additionally, silicon carbide samples were covered with a layer of tungsten and molybdenum using chemical vapour deposition (CVD) technique. Microstructural examinations and thermal properties measurements were performed. A special attention was put to the metal-ceramic interface. During annealing at a high temperature, copper reacts with silicon carbide. To prevent the decomposition of silicon carbide two types of coating (tungsten and molybdenum) were applied. The effect of covering SiC with the aforementioned elements on the composite’s thermal conductivity was analyzed. Results were compared with the numerical modelling of heat transfer in Cu-SiC-Cu systems. Certain possible reasons behind differences in measurements and modelling results were discussed.

Słowa kluczowe

EN

copper matrix composites; silicon carbide; interface; thermal conductivity; modelling

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1311--1314
• Opis fizyczny: Bibliogr. 10 poz., rys., wzory

Twórcy

autor

Strojny-Nędza A.

• Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland

autor

Pietrzak K.

• Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland

autor

Teodorczyk M.

• Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland

autor

Basista M.

• Institute of Fundamental Technological Research, Polish Academy of Sciences, 5b Pawinski Str., 02-106 Warsaw, Poland

autor

Węglewski W.

• Institute of Fundamental Technological Research, Polish Academy of Sciences, 5b Pawinski Str., 02-106 Warsaw, Poland

autor

Chmielewski M.

• Institute of Electronic Materials Technology, 133 Wólczyńska Str, 01-919 Warsaw, Poland

Bibliografia

• [1] A.K. Sahoo, S. Pradhan, A.K. Rout, Archiv. Civ. Mech. Eng. 3, 27-35 (2013).
• [2] W. Węglewski, M. Basista, M. Chmielewski, K. Pietrzak, Compos. Part B 43 (2), 255-264 (2012).
• [3] W. Węglewski, M. Basista, A. Manescu, M. Chmielewski, K. Pietrzak, Th. Schubert, Compos. Part B 67, 119-124 (2014).
• [4] M. Chmielewski, W. Węglewski, Bull. Pol. Acad. Sci-Te. 61 (2), 507-514 (2013).
• [5] Z. Lin, Q. Xuan-Hui, D. Bai-Hua, H. Xin-Bo, Q. Ming-Li, R. Shu--Bin, Int. J. Miner. Metall. Mater. 16 (3), 327-33 (2009).
• [6] F. de Monte, Int. J. Heat Mass Trans. 43, 3607-3619 (2000).
• [7] Y. Sun, I.S. Wichman, Int. J. Heat Mass Trans. 47, 1555-1559 (2004).
• [8] A. Haji-Sheikh, J.V. Beck, D. Agonafer, Int. J. Heat Mass Trans. 46, 2363-2379 (2003).
• [9] B. Yang, H. Shi, Int. J. Heat Mass Trans. 131, 111304 (2009).
• [10] Y.F. Sun, H. Fujii, Mater. Sci. Eng. A 528, 5471-5475 (2011).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)