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Realization of logic integrated circuits in VeSTIC process - design, fabrication, and characterization

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EN
Abstrakty
EN
A design and manufacturing of test structures for characterization of logic integrated circuits in a VeSTIC process developed in ITE, are described. Two variants of the VeSTIC processs have been described. A role and sources of the process variability have been discussed. The VeSFET I-V characteristics, the logic cell static characteristics, and waveforms of the 53-stage ring oscillator are presented. Basic parameters of the VeSFETs have been determined. The role of the process variability and of the parasitic elements introduced by the conservative circuit design, e.g. wide conductive lines connecting the devices in the circuits, have been discussed. Based on the inverter layout and on the process specification, the parasitic elements of the inverter equivalent circuit have been extracted. The inverter propagation times, the ring oscillator frequency, and their dependence on the supply bias have been determined.
Twórcy
  • Division of Silicon Microsystem and Nanostructure Technology, Instytut Technologii Elektronowej (ITE), Warsaw, Poland
  • Division of Silicon Microsystem and Nanostructure Technology, Instytut Technologii Elektronowej (ITE), Warsaw, Poland
  • Division of Silicon Microsystem and Nanostructure Technology, Instytut Technologii Elektronowej (ITE), Warsaw, Poland
  • Division of Silicon Microsystem and Nanostructure Technology, Instytut Technologii Elektronowej (ITE), Warsaw, Poland
  • Division of Silicon Microsystem and Nanostructure Technology, Instytut Technologii Elektronowej (ITE), Warsaw, Poland
Bibliografia
  • [1] W. Maly, “Integrated Circuit, Device, System, and Method of Fabrication”, U.S Patent 2009/0321830, Dec. 31, 2009
  • [2] W. Maly and A. Pfitzner, “Complementary vertical transistors”, Carnegie Mellon Univ., Pittsburgh, PA, CSSI Tech. Rep. 08-02, Jan. 2008
  • [3] W. Maly et al., “Twin gate, vertical slit FET (VeSFET) for highly periodic layout and 3D integration”, Proc. 18th Int. Conf. MIXDES, 2011, pp. 145–150
  • [4] A. Pfitzner, “Vertical-Slit Field-Effect Transistor (VeSFET) - design space exploration and DC model”, Proc. 18th Int. Conf. MIXDES, 2011, pp. 151–156
  • [5] A. Pfitzner, M. Staniewski, M. Strzyga, "DC Characteristics of Junction Vertical Slit Field-Effect Transistor (JVeSFET)”, Proc. 16th Int. Conf. MIXDES, 2009, pp. 420-422
  • [6] P. Mierzwiński, W. Kuźmicz, K. Domański, D. Tomaszewski, G. Gluszko, "Bipolar transistor in VESTIC technology: prototype", Proc. SPIE 10175, Electron Technology Conference 2016
  • [7] P-L. Yang, T. B. Hook, P. J. Oldiges and B. B. Doris, “Vertical Slit FET at 7-nm Node and Beyond”, IEEE Trans. Electron Devices, 2016, Vol.63, No. 8, pp. 3327 – 3334, 2016
  • [8] Z. Chen, A. Kamath, N. Singh, N. Shen, X. Li, G.-Q. Lo, D.-L. Kwong, D. Kasprowicz, A. Pfitzner, W. Maly, "N-channel Junction-less Vertical Slit Field-Effect Transistor (VeSFET): Fabrication-based Feasibility Assessment", Proc. 2012 Int. Conf. Solid-State and Integrated Circuit (ICSIC 2012)
  • [9] D. Tomaszewski, K. Domański, G. Głuszko, A. Sierakowski and D. Szmigiel, "MOSFETs in the VeSTIC process - fabrication and characterization," 2017 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), 2017, pp. 71-74
  • [10] G. Głuszko, D. Tomaszewski and K. Domański, "Electrical characterization of different types of transistors fabricated in VeSTIC process", Proc. 24th Int. Conf. MIXDES, 2017, pp. 132-136
  • [11] M. Pastre, F. Krummenacher, L. Barbut., J.-M. Sallese, M. Kayal, "Towards Circuit design Using VeSFETs", Proc. 18th Int. Conf. MIXDES, 2011, pp. 139-144
  • [12] A. Kamath, Z. Chen, N. Shen, N. Singh, G. Q. Lo, D.-L. Kwong, D. Kasprowicz, A. Pfitzner, W. Maly, "Realizing AND and OR Functions With Single Vertical-Slit Field-Effect Transistor", IEEE Electron Device Let., Vol. 33, No. 2, pp. 152-154, 2012
  • [13] P.-L. Yang, M. Marek-Sadowska, W. Maly, "Performance assessment of VeSFET-based SRAM", Proc. 2015 IEEE Int. Conf. Electron Devicesand Solid-State Circuits (EDSSC), pp. 79-82
  • [14] D. Tomaszewski, K. Domański, G. Głuszko, A. Sierakowski, D. Szmigiel, "An Effect of Device Topology in VeSTIC Process onLogic Circuit Operation - A Study Based on Ring Oscillator Operation Analysis", Proc. 25th Int. Conf. MIXDES, 2018, pp. 51-56
  • [15] D. Tomaszewski, G. Głuszko, J. Malesińska, K. Domański, M. Zaborowski, K. Kucharski, D. Szmigiel, A. Sierakowski, "A Simple Method for Characterization of MOSFET Serial Resistance Asymmetry", Proc. 28th IEEE Int. Conf. on Microelectronic Test Structures, Phoenix, 23-26.03.2015, pp. 116-121
  • [16] N. H. E. Weste, D. Harris, "CMOS VLSI Design - A Circuits and Systems Perspective", 3rd Ed., Pearson Education, Inc., 2005
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-02b8d5fe-dc10-4a38-837f-f4712a472e59
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