Investigation of Multicomponent Lead-Free Solders

• Autorzy: Gyenes A. , Benke M. , Teglas N. , Nagy E. , Gacsi Z.

Identyfikatory

DOI

10.1515/amm-2017-0156

• Języki publikacji: EN

Abstrakty

EN

According to the directives (RoHS and WEEE) adopted by the European Union, lead has been banned from the manufacturing processes because of its health and environmental hazards. Therefore, the development of lead-free solders is one of the most important research areas of the electronic industry. This paper investigates multicomponent Sn-Ag-Cu based lead-free solders with different compositions. The properties of the six-component Innolot (SAC+BiSbNi) and two low-Ag containing alloys were compared with the widespread used SAC307 solder. Microstructure investigations and X-ray diffraction measurements were performed to analyze and identify the formed phases, furthermore, tensile tests and microhardness measurements were executed to determine the mechanical properties of the examined solders.

Słowa kluczowe

EN

lead-free solder; multi-component; microstructure; X-ray diffraction; mechanical properties

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2017
• Tom: Vol. 62, iss. 2B
• Strony: 1071--1074
• Opis fizyczny: Bibliogr. 7 poz., rys., tab.

Twórcy

autor

Gyenes A.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

autor

Benke M.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

autor

Teglas N.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

autor

Nagy E.

• MTA-ME Materials Science Research Group, University of Miskolc, H-3515 Miskolc-Egyetemvaros, Hungary

autor

Gacsi Z.

• Institute of Physical Metallurgy, Metal forming and Nanotechnology, University of Miskolc, H-3515 Miskolc-Egyetemvaros, B1/109., Hungary

Bibliografia

• [1] K. J. Puttlitz, K. A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, New York: Marcel Dekker (2004).
• [2] J. Bath, Lead-Free Soldering, New York: Springer (2007).
• [3] J. H. L. Pang, Lead Free Solder, Mechanics and Reliability, New York: Springer (2012).
• [4] T. K. Lee, T.R. Bieler, C.U. Kim, H. Ma, Fundamentals of Lead--Free Solder Interconnect Technology; From Microstructures to Reliability, New York: Springer (2015).
• [5] A.Z. Miric, New developments in high-temperature, high-performance lead-free solder alloys. Proceedings of the SMTA International Conference, Orlando, FL, October 24-28. (2010).
• [6] H. Steen, B. Toleno, Development of a lead-free alloy for high--reliability, high-temperature applications (2010)., http://www.hlinstruments.com/RoHS_articles (downloaded on 01/07/2016).
• [7] http://elektro-net.hu/gyartosor/2075-sacx-valasz-az-uj-kihivasraaz-olommentes-forrasztas-teruleten (downloaded on 01/07/2016).

Uwagi

PL

Opracowanie ze środków MNiSW w ramach umowy 812/P-DUN/2016 na działalność upowszechniającą naukę (zadania 2017)