Heat transfer simulations in the frequency domain with the application of thermal influence coefficients method

• Autorzy: Gnidzińska K. , Jabłoński G. , Napieralski A. , De Mey G
• Języki publikacji: EN

Abstrakty

EN

In this paper an extension of thermal influence coefficients method to frequency domain has been presented. The method allowed the steady-state analysis of three-dimensional heat flow in multilayered structures. The presented modelling is based on Fourier and Hankel transforms, two-port network theory and correction coefficients for close-area distances, allowing emulation of finite heat sources by infinitesimal ones.

Słowa kluczowe

EN

thermal modelling; thermal simulation; AC; alternating current

PL

modelowanie cieplne; symulacja termiczna; AC; prąd przemienny

• Wydawca: Lodz University of Technology. Department of Microelectronics and Computer Science
• Czasopismo: International Journal of Microelectronics and Computer Science
• Rocznik: 2013
• Tom: Vol. 4, nr 4
• Strony: 164--169
• Opis fizyczny: Bibliogr. 9 poz.

Twórcy

autor

Gnidzińska K.

• Department of Microelectronics and Computer Science, Lodz University of Technology, ul. Wolczanska 221/225, 90-924 Lodz, Poland

autor

Jabłoński G.

• Department of Microelectronics and Computer Science, Lodz University of Technology, ul. Wolczanska 221/225, 90-924 Lodz, Poland

autor

Napieralski A.

• Department of Microelectronics and Computer Science, Lodz University of Technology, ul. Wolczanska 221/225, 90-924 Lodz, Poland

autor

De Mey G

• Department of Electronics and Information Systems, Ghent University, Sint Pietersnieuwstraat 41, 9000 Gent, Belgium

Bibliografia

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• [2] P. Leturcq, J.-M. Dorkel, A. Napieralski and E. Lachiver, A new approach to thermal analysis of power devices IEEE Transactions on Electron Devices, vol. ED-34, No. 5, May 1987
• [3] R. Piessens, The Hankel Transform The Transforms and Applications Handbook: Second Edition
• [4] J.-M. Dorkel, P. Tounsi, P. Leturcq, Three-Dimensional Thermal Modelling Based on the Two-Port Theory for Hybrid or Monolithic Integrated Power Devices IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 19, No. 4, December 1996
• [5] Lokenath Debnath, Dambaru Bhatta, Integral Transforms and Their Applications, 2007
• [6] Poularikas A. D. The Hankel Transform, CRC Press LLC,1999
• [7] Abramowitz, Milton; Stegun, Irene A., eds. (1972), Handbook of Mathematical Functions with Formulas, Graphs, and Mathematical Tables, New York: Dover Publications, ISBN 978-0-486-61272-0
• [8] K. Gnidzinska, The aberrations of the AC thermal characteristics in the presence of solder defects in multilayer microelectronic structures International Journal of Microelectronics and Computer Science, 2011, Vol. 2, no. 4
• [9] J. ,V. Beck, K. D. Cole, A. Haji-Sheikh, B. Litkouhi Heat Conduction Using Green’s Function, Series in Computational Methods and Physical Processes in Mechanics and Thermal Sciences Series, 1992