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2018 | vol. 61, nr 202 | 145--152
Tytuł artykułu

Thermal conductivity of wooden floors in the context of underfloor heating system applications

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Wood, as a traditional flooring material, has fairly low thermal conductivity; hence achieving heat resistance at a level ensuring good heat transfer from the heating system to the room is very important. This can be achieved by selecting the right materials or by applying appropriate design solutions. Determining properties associated with heat transport for construction products usually involves determining the heat transfer coefficients of building envelopes in the context of thermal insulation. However, in the case of buildings with underfloor heating the expectations are reversed – flooring elements should have good thermal conductivity, i.e. low thermal resistance (below 0.15 m2K/W). This condition was satisfied by almost all tested types of floorings. On comparison of the test results with the calculations, it was found that the calculated values of thermal resistance were lower than the experimental values, which may suggest that in relation to use on underfloor heating the calculated values imply better properties than are achieved in practice.
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Rocznik
Strony
145--152
Opis fizyczny
Bibliogr. 13 poz., rys., tab.
Twórcy
Bibliografia
  • Kamke F.A., Zylkowski S.C. [1989]: Effects of wood-based panel characteristics on thermal conductivity. Forest Products Journal 39 [5]: 19-24
  • Krzysik F. [1975]: Nauka o drewnie. Warsaw
  • MacLean J.D. [1941]: Thermal Conductivity of Wood. Heating, Piping and Air Conditioning 13 [6]: 380-391
  • Nowicki J., Chmielowski A. [1998]: Ogrzewanie podłogowe. Poradnik. Ośrodek Informacji „Technika Instalacyjna w Budownictwie”, Warsaw
  • Rozins R., Iejavs J. [2014]: Evaluation of thermal properties of wood based composite panel walls. Research for Rural Development 2: 109-114
  • Seo J., Jeon J., Lee J-H., Kim S. [2011]: Thermal performance analysis according to wood flooring structure for energy conservation in radiant floor heating systems. Energy and Buildings 43: 2039-2042
  • Seo J., Park Y., Kim J., Kim Sughwan, Kim Sumin, Kim J.T. [2014]: Comparison of thermal transfer characteristics of wood flooring according to the installation method. Energy and Buildings 70: 422-426
  • Suleiman B.M., Larfeldt J., Leckner B., Gustavsson M. [1999]: Thermal conductivity and diffusivity of wood. Wood Science and Technology 33: 465-473
  • TenWolde A., McNatt J.D., Krahn L. [1988]: Thermal properties of wood and wood panel products for use in buildings. Forest Products Laboratory Madison
  • Woźniak T. [2016]: Posadzki drewniane na podkładach grzewczych z funkcją chłodzenia – podstawowe zależności. Profesjonalny Parkiet no. 3/85
  • List of standards
  • EN 12664:2001 Thermal performance of building materials and products – Determination of thermal resistance by means of guarded hot plate and heat flow meter methods – Dry and moist products of medium and low thermal resistance
  • EN 14342:2013 Wood flooring and parquet – Characteristics, evaluation of conformity and marking
  • CEN/TS 15717:2008 Parquet flooring – General guideline for installation
Typ dokumentu
Bibliografia
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bwmeta1.element.baztech-e4d73643-492d-4e0f-b702-82fc1709efa8
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