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Liczba wyników
2014 | nr 84 | 119--133
Tytuł artykułu

Elements of cooling systems of power leds

Wybrane pełne teksty z tego czasopisma
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
In the paper the problem of cooling power LEDs is considered. Modern solutions of packages of power LEDs and elements which improve the removal of heat generated in these devices are presented. Especially, much attention is paid to geometrical dimensions of the packages and construction elements of the heat flow path in free and forced cooling systems.
Wydawca

Rocznik
Tom
Strony
119--133
Opis fizyczny
Bibliogr. 45 poz., rys., tab.
Twórcy
autor
  • Gdynia Maritime University Faculty of Marine Electrical Engineering Poland
autor
  • Gdynia Maritime University Faculty of Marine Electrical Engineering Poland
Bibliografia
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  • [5] Craford M.G., Recent progress of LEDs for lighting, Lumileds, 2001.
  • [6] Martin P.S., High power white LED Technology for Solid State Lighting, Lumileds 2005.
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  • [8] Jaworowska M., Oświetlenie ledowe staje się coraz powszechniejsze, Elektronik, No.4, 2014.
  • [9] Magdziak R., Oświetlenie LED Raport techniczno-rynkowy, Elektronik, No. 4, 2014.
  • [10] Tietze U., Schenk Ch., Układy półprzewodnikowe, WNT Warszawa 1996.
  • [11] Mroziewicz B., Biało świecące diody LED rewolucjonizują technikę oświetleniową, Elektronika, No. 9, 2010, pp. 145–154.
  • [12] Narendran N., Gu Y., Life of LED-based white light sources, Journal of Display Technology, Vol. 1, No. 1, 2005, pp. 167–171.
  • [13] Qin Y., Lin D., Hui S.Y., A simple method of comparative study on the thermal Performance of LEDs and fluorescent lamps, IEEE Transactions on Power Electronics, Vol. 24, 2009, No. 7, pp. 1811–1818.
  • [14] Schubert E.F., Light Emitting Diodes. Second Edition, Cambridge University Press, New York 2008.
  • [15] Danner T., Zahner T., Inline Rth Control: Fast Thermal Transient Evaluation for High Power LEDs, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 25–27 Sept 2013, pp. 172–175.
  • [16] Górecki K., Górecka K., Wpływ zjawisk cieplnych na właściwości diody LED mocy, Przegląd Elektrotechniczny, Vol. 87, No. 7, 2011, pp. 144–147.
  • [17] Górecki K., The Influence of Mutual Thermal Interactions Between Power LEDs on Their Characteristics, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 25–27 Sept 2013, pp. 188–193.
  • [18] Górecki K., Ptak P., The Influence of the Mounting Manner of the Power LEDs on its Thermal and Optical Parameters, Proceedings of the 21st International Conference Mixed Design of Integrated Circuits and Systems MIXDES, 2014, Lublin, pp. 303– 308”.
  • [19] Ptak P., Diody LED mocy, Praca dyplomowa inżynierska, Akademia Morska w Gdyni, Wydział Elektryczny, Gdynia 2009.
  • [20] Diody LED mocy, Elektronika Praktyczna, May 2009, pp. 84–86.
  • [21] Weise S., Zahner Th., Lutz Th., Stich A., Reliability of the DRAGON Product Family, www.osram-os.com.
  • [22] Gawryluk A., Zasilanie diod LED dużej mocy, Elektronika Praktyczna Plus, Mar 2007, pp. 89–94.
  • [23] Yu J., Cennini G., Improving Thermal Conductivity of Polimer Composites in Embedded LEDs, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 25–27 Sept 2013, pp. 176–180.
  • [24] Anithanbigai P., Shanmugan S., Mutharasu D., Zahner T., Lacey D., Study on Thermal Performance of High Power LED Employing Aluminium Filled Epoxy Composite as Thermal Interface Material, Therminic 2013 19th International Workshop Thermal Investigations of IC’s and Systems, 2013, pp. 181–187.
  • [25] Datasheet LP9KLB, Ledtech Industries, www.ledtech.com.tw
  • [26] Philips Lumileds Site, www.philipslumileds.com
  • [27] Datasheet Luxeon CoB, http://www.philipslumileds.com/uploads/419/DS115-pdf
  • [28] Annandale T., Kelly H., Luxeon Altilon moves automotive headlamps forward into the 21st century, LED’s Magazine, Mar 2009, pp. 26–28.
  • [29] Datasheet Luxeon Rebel K2, www.luxeonstar.com/v/vspfiles/downloadables/ds60.pdf
  • [30] Datasheet Luxeon Altilon, http://www.philipslumileds.com/uploads/39/DS66-pdf
  • [31] Datasheet Luxeon Rebel Plus, www.philipslumileds.com/uploads/380/DS107-pdf
  • [32] Datasheet Luxeon Q, www.philipslumileds.com/uploads/428/DS118-pdf
  • [33] Shchekin O., Sun D., Evolutionary new chip design targets lighting systems, Compound Semiconductor, Vol. 13, No. 2, Mar 2007.
  • [34] OSRAM Semiconductor Site, www.osram-os.com/osram_os/en
  • [35] Ceramic TopLooker for high light output, designed for camera flash application, www.osram-os.com.
  • [36] Datasheet Oslon SSL 80, www.osram-os.com/Graphics/XPic3/00088575_0.pdf.
  • [37] Datasheet Ostar LE UW S2LN, ledlight.osram-os.com/wp-content/uploads/2011/ 10/9-LE_UW_S2LN.pdf.
  • [38] Cree Site, www.cree.com
  • [39] Datasheet XLamp XR-E, www.alldatasheet.com/datasheet-pdf/pdf/194318/CREE/ XR-E.html.
  • [40] Datasheet XLamp XM-L2, www.farnell.com/datasheets/1755855.pdf.
  • [41] Datasheet XLamp MC-E, www.led-tech.de/produkt-pdf/cree/xlamp_mce.pdf.
  • [42] Furnival C.R., Thermal and High Current Multilayer Printed Circuit Boards with Thermagon T-lam and Hybrid Boards, Thermagon Inc, Jan 2001.
  • [43] Huber R., Thermal Management of Golden DRAGON LED, www.osram-os.com
  • [44] Sunon Company Site, www.sunon.com
  • [45] Kalinowski C., Aktywne chłodzenie dla LED dużej mocy, Elektronik No. 5, 2013, pp. 96–97.
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.baztech-d27310c0-71f1-487e-8301-85bfd0268d67
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