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2019 | Vol. 65, No. 2 | 44--47
Tytuł artykułu

Thermal investigations of PCM enhanced electronics cooling

Treść / Zawartość
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
The paper presents experimental results of PCM (Phase Change Material) enhanced cooling system. The investigations were focused on obtaining the best results of the cooling system during its start-up. The latent heat of phase change material was used to decrease temperature of the cooled electronic device. Comparison of a standard heat sink available on the market and the same heat sink filled with PCM applications was done. Temperature was monitored and registered during device start-up until its thermal steady state. It was done using contact and IR temperature measurement methods. PCMs usage enabled to absorb heat during electronic device start-up. The paper proves that using PCMs it is possible to delay temperature rise during electronic devices heating.
Wydawca

Rocznik
Strony
44--47
Opis fizyczny
Bibliogr. 12 poz., rys., wykr., wzory
Twórcy
Bibliografia
  • [1] JEDEC JESD51 Methodology for Thermal Measurement of Component Packages (Single Semiconductor Device), 1995.
  • [2] JEDEC JESD51-1 Integrated Circuit Thermal Measurement Method - Electrical Test Method (Single Semiconductor Device), 1995.
  • [3] Kałuża K., Felczak M., and Więcek B.: Thermal analysis and measurements of spiral inductors using built-in and IR sensors. QIRT Conference, 2014.
  • [4] Sawicki J., Dudek M., Kaczmarek Ł., Wiecek B., Swiatczak T., Olbrycht R. (n.d.): Numerical Analysis of Thermal Stresses in Carbon Films Obtained by the RF Pecvd Method on the Surface of a Cannulated Screw. Archives of Metallurgy and Materials, 2013, 58(1), 77-81. doi: https://doi.org/10.2478/v10172-012-0154-9.
  • [5] Pourakabara A., Rabienataj Darzib A. A.: Enhancement of phase change rate of PCM in cylindrical thermal energy storage. Applied Thermal Engineering, 150 (2019), pp. 132–142.
  • [6] Vermaa A., Shashidharab S., Rakshita D.: A comparative study on battery thermal management using phase change material (PCM). Thermal Science and Engineering Progress, 11 (2019), pp. 74–83.
  • [7] Santos T., Kolokotroni M., Hopper. N, Yearley K.: Experimental study on the performance of an new encapsulation panel form PCM’s to be used in the PCM-Air heat exchanger. 2nd International Conference on Sustainable Energy and Resource Use in Food Chains, ICSEF 2018, 17-19 October 2019, Paphos, Cyprus, Energy Procedia, 161 (2019) 352-359.
  • [8] Kawka P., De Mey G., Vermeersch B.: Thermal characterization of electronic packages using the Nyquist plot of the thermal impedance, IEEE Transaction on Components and Packaging Technologies, 2007, vol. 30, pp. 660-665.
  • [9] Vermeersch B., De Mey G.: Thermal impedance plots of micro scaled devices. Microelectronics Reliability, 2006, vol. 46, pp. 174-177.
  • [10] Vermeersch B., De Mey G.: Influence of substrate thickness on thermal impedance of microelectronic structures. Microelectronics Reliability, 2007, vol. 47, pp. 437-443.
  • [11] Székely V.: A new evaluation method of thermal transient measurement results. Microelectrics Journal, Vol. 28, pp. 277-292, 1997.
  • [12] https://www.rubitherm.eu/en/productCategories.html
Uwagi
PL
Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.baztech-5e64ec7c-9a38-460d-bd92-0ccfa1c6713e
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