PL EN


Preferencje help
Widoczny [Schowaj] Abstrakt
Liczba wyników
Czasopismo
2009 | 7 | 2 | 379-384
Tytuł artykułu

Structural, morphology and electrical properties of layered copper selenide thin film

Treść / Zawartość
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Thin films of copper selenide (CuSe) were physically deposited layer-by-layer up to 5 layers using thermal evaporation technique onto a glass substrate. Various film properties, including the thickness, structure, morphology, surface roughness, average grain size and electrical conductivity are studied and discussed. These properties are characterized by X-ray diffraction (XRD), atomic force microscopy (AFM), ellipsometer and 4 point probe at room temperature. The dependence of electrical conductivity, surface roughness, and average grain size on number of layers deposited is discussed.
Wydawca

Czasopismo
Rocznik
Tom
7
Numer
2
Strony
379-384
Opis fizyczny
Daty
wydano
2009-06-01
online
2009-04-26
Twórcy
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
autor
  • Faculty of Science, Universiti Putra Malaysia, 43400 UPM, Serdang, Malaysia
Bibliografia
  • [1] S. Y. Zhang et al., Cryst. Growth Des. 6, 2809 (2006) http://dx.doi.org/10.1021/cg0604430[Crossref]
  • [2] S. T. Lakshmikumar, A. C. Rastogi, Sol. Energ. Mat. Sol. C. 32, 7 (1994) http://dx.doi.org/10.1016/0927-0248(94)90251-8[Crossref]
  • [3] W. S. Chen, J. M. Stewart, R. A. Mickelsen, Appl. Phys. Lett. 46, 1095 (1985) http://dx.doi.org/10.1063/1.95773[Crossref]
  • [4] C. Levy-Clement, M. Neumann-Spallart, S. K. Haram, K. S. V. Santhanam, Thin Solid Films 302, 12 (1997) http://dx.doi.org/10.1016/S0040-6090(97)00021-7[Crossref]
  • [5] V. M. Bhuse, P. P. Hankare, K. M. Garadkar, A. S. Khomane, Mater. Chem. Phys. 80, 82 (2003) http://dx.doi.org/10.1016/S0254-0584(02)00306-1[Crossref]
  • [6] S. R. Gosavi, N. G. Deshpande, Y. G. Gudage, R. Sharma, J. Alloy Compd. 448, 344 (2008) http://dx.doi.org/10.1016/j.jallcom.2007.03.068[Crossref]
  • [7] D. Lippkow, H. H. Strehblow, Electrochim. Acta 43, 2131 (1998) http://dx.doi.org/10.1016/S0013-4686(97)10148-7[Crossref]
  • [8] H. M. Pathan, C. D. Lokhande, D. P. Amalnerkar, T. Seth, Appl. Surf. Sci. 211, 48 (2003) http://dx.doi.org/10.1016/S0169-4332(03)00046-1[Crossref]
  • [9] R. Cordova et al., J. Phys. Chem. B 109, 3212 (2005)
  • [10] V. Saltas et al., Surf. Rev. Lett. 7, 235 (2000)
  • [11] Al-Mamun, A. B. M. O. Islam, Int. J. Mod. Phys. B 18, 3063 (2004) http://dx.doi.org/10.1142/S021797920402638X[Crossref]
  • [12] Al-Mamun, A. B. M. O. Islam, A. H. Bhuiyan, J. Mater. Sci.-Mater. El. 16, 263 (2005) http://dx.doi.org/10.1007/s10854-005-0543-1[Crossref]
  • [13] E. Andrade et al., Nucl. Instrum. Meth. B 161-163,635 (2000) http://dx.doi.org/10.1016/S0168-583X(99)00994-5[Crossref]
  • [14] R. M. A. Azzam, N. M. Bashara, Ellipsometry and polarized light (North-Holland, Amsterdam, 1997)
  • [15] H. G. Tompkins, A user’s guide to ellipsometry (Academic Press, Boston, 1993)
  • [16] L. B. Valdes, Proceedings of the IRE 42, 420 (1954) http://dx.doi.org/10.1109/JRPROC.1954.274680[Crossref]
  • [17] S. Agilan, D. Mangalaraj, S. K. Narayandass, G. Mohan Rao, Physica B 365, 93 (2005) http://dx.doi.org/10.1016/j.physb.2005.05.001[Crossref]
  • [18] J. M. Pawlikowski, Thin Solid Films 127, 29 (1985) http://dx.doi.org/10.1016/0040-6090(85)90210-X[Crossref]
  • [19] E. E. Khawaja, J. Phys. D Appl. Phys. 9, 1939 (1976) http://dx.doi.org/10.1088/0022-3727/9/14/003[Crossref]
  • [20] J. C. Manifacier, J. Gasiot, P. Fillard, J. Phys. E Sci. Instrum. 9, 1002 (1976) http://dx.doi.org/10.1088/0022-3735/9/11/032[Crossref]
  • [21] R. S. Mane, B. R. Sankapal, C. D. Lokhande, Mater. Chem. Phys. 64, 215 (2000) http://dx.doi.org/10.1016/S0254-0584(99)00261-8[Crossref]
  • [22] Z. J. Liu and Y. G. Shen, Appl. Phys. Lett. 84, 5121 (2004) http://dx.doi.org/10.1063/1.1764598[Crossref]
  • [23] L. Y. Huang, L. Meng, Mat. Sci. Eng. B.-Solid 137, 310 (2007) http://dx.doi.org/10.1016/j.mseb.2006.11.029[Crossref]
  • [24] P. G. Ganesan, V. D. Das, Mater. Lett. 60, 2059 (2006) http://dx.doi.org/10.1016/j.matlet.2006.02.025[Crossref]
  • [25] J. Y. W. Seto, J. Appl. Phys. 46, 5247 (1975) http://dx.doi.org/10.1063/1.321593[Crossref]
  • [26] S. S. Lin, J. L. Huang, D. F. Lii, Surf. Coat. Tech. 190, 372 (2005) http://dx.doi.org/10.1016/j.surfcoat.2004.03.009[Crossref]
  • [27] S. Christoulakis et al., Appl. Surf. Sci. 252, 5351 (2006) http://dx.doi.org/10.1016/j.apsusc.2005.12.071[Crossref]
  • [28] M. Lakshmi et al., Thin Solid Films 386, 127 (2001) http://dx.doi.org/10.1016/S0040-6090(00)01783-1[Crossref]
Typ dokumentu
Bibliografia
Identyfikatory
Identyfikator YADDA
bwmeta1.element.-psjd-doi-10_2478_s11534-009-0057-1
JavaScript jest wyłączony w Twojej przeglądarce internetowej. Włącz go, a następnie odśwież stronę, aby móc w pełni z niej korzystać.