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Journal of Telecommunications and Information Technology
2002 nr 2 40-44
EN In this paper, we present a new approach for capacitance matrix calculation of lossy multilayer VLSI interconnects based on quasi-static analysis and Fourier projection technique. The formulation is independent from the position of the interconnect conductors and number of layers in the structure, a[...]
Journal of Technical Physics
EN Simple and accurate closed-form model enabling to calculate frequency-dependent distributed inductance and associated distributed series resistance per-unit-length of single on-chip interconnects on a lossy silicon substrate is presented. The closed-form formulas for the frequency-dependent series i[...]
Optica Applicata
EN Porous glasses are widely used in microelectronics as inter-metal dielectrics with low dielectric constant (so-called low-k dielectrics). At the same time copper is used as a metal because of its low resistivity. Combination of Cu and low-k requires a barrier to prevent Cu diffusion into a low-k die[...]
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