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Identification of Bee Colony Acoustic Signals using the Dynamic Time Warping Algorithm

Polyniak Yu., Fedasyuk D., Marusenkova Tetyana

ECONTECHMOD : An International Quarterly Journal on Economics of Technology and Modelling Processes

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2019

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Vol. 8, No 4

19--27

EN

The work deals with automated recognition of the current state of a bee colony, for continuous monitoring of processes running in a bee hive is of key importance in beekeeping. The dynamic time warping algorithm is considered as a method of analyzing acoustic signals produced by a bee colony. Upon such an analysis one can make inferences about the current state of the colony. We have developed a software module for audio-signal identification, which is to be used as a part of an automated bee colony monitoring system, and a software tool for verification of the module. We evaluated the efficacy of the algorithm, the probability of bee colony states correctly recognized using acoustic signals produced by the colony and consumed computational resources by the example of a queen bee’s sounds recorded during swarming. The dependencies of the signal processing time and the successful pattern recognition probabilities on the frame sample rate and frame size are presented.

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Variables state-based software usage model

Fedasyuk D., Yakovyna V., Serdyuk P., Nytrebych O.

ECONTECHMOD : An International Quarterly Journal on Economics of Technology and Modelling Processes

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2014

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Vol. 3, No 2

15--20

EN

This article describes a new mathematical software usage model, which includes the effect of the set of global and external variables values for further analysis of multi-test scenarios to improve the effectiveness of the testing software. This model is represented as a graph of transitions and a set of variables with respective sets of equivalence classes. The proposed approach is particularly relevant for computational algorithms with complex logic.

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Modeling and optimization of thermo-mechanical behavior of power semiconductor diodes

Fedasyuk D., Makar V.

Mikroelektronika i Informatyka : prace naukowe

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2004

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Z. nr 4

49-54

EN

Thermal stresses in microelectronics are produced by the mismatch between the thermo-mechanical properties of different components in devices. This paper presents a numerical model which allows to predict and optimize a thermo-mechanical behavior of power semiconductor devices at the earlier phase of the product development processes. It is very important to provide reliability, to reduce a number of expensive physical experiments and to obtain optimal design. As the demonstrator, an soldered power semiconductor diode has been considered to show the robustness and capability of the proposed approach for transient temperature and thermal stresses characterization.