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The influence of welding heat input on the microstructure of joints of S1100QL steel in one-pass welding

Nowacki J., Sajek A., Matkowski P.

Archives of Civil and Mechanical Engineering

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2016

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Vol. 16, no. 4

777--783

EN

Microstructure transformations of a welded joint of the of quenched and tempered advanced high-strength S1100QL steel in relation to the heat input and its effect on the strength of the joint. The gas metal arc welding method was used with varying values of the heat input in the range from 5.5 to 7.1 kJ/cm. Metallographic examination, hardness, impact strength, and tensile strength tests were carried out. Innovative methodology of welding impact test using drop tower impact resistance tester, has been applied. Joints with strength higher than that of welded steel were created. The amount of heat input necessary to produce joints of S1100QL steel whose strength would be higher than that of parent material was determined. The advantages of using S1100QL steel were indicated and a method of one-pass welding that allows for production of joints of optimum strength parameters with the use of mismatched filler metals was presented. As the result of detailed weld cracking dynamics analysis of the S1100QL steel the course of joint deformation was determined as a function of time, loading force and impact energy. It was found that the dynamically loaded samples welded with lower heat input display higher limit of elasticity, which is manifested by higher loading forces and longer deformation time.

2

Zastosowanie tlenku grafenu i grafenu w technologii diod laserowych

Dąbrowska E., Teodorczyk M., Lipińska L., Krzyżak K., Dąbrowski A., Sobczak G., Kozłowska A., Matkowski P., Młożniak A., Maląg A.

Przegląd Elektrotechniczny

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2015

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R. 91, nr 9

1-4

PL

Wykazano, że tlenek grafenu na krawędziach bocznych chipa laserowego powoduje zmniejszenie rezystancji termicznej diody laserowej. Obserwowane jest również zmniejszenie temperatury samego chipa laserowego. Natomiast tlenek grafenu na n-kontakcie powoduje zwiększenie temperatury chipa. Na n-kontakcie korzystne jest zastosowanie grafenu. Pokazano przesuwanie się charakterystyk spektralnych przy zastosowaniu tlenku grafenu i grafenu, jak również zmiany ugięcia chipa laserowego w obecności tlenku grafenu i grafenu. Pomiary wykonano dla diod na pasmo 880 nm.

EN

It has been shown that covering side walls of a laser diode’s chip with graphene oxide (GO) results in reduction of the laser diode's thermal resistance. Reduction of the temperature of the diode itself is also observed. In turn, additional covering the n-contact of the chip with GO results in the diode's temperature increase. On the other hand, alternative application of a chemical graphene layer in this place gives further temperature decrease. This can be explained by much higher emissivity of graphene layer compared to GO. The shifts of lasing spectral characteristics (in the 880 nm band) as well as changes in chip's deflection connected with GO and graphene applications are also shown.

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PTA-GMA hybrid welding of UHSS steel in structures of large-scale

Nowacki J., Krajewski S., Matkowski P.

Archives of Materials Science and Engineering

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2015

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Vol. 71, nr 2

53--62

EN

Purpose: An analysis of application possibilities for PTA-GMA hybrid welding in large-sized high- strength steel structures that require using particularly effective and high-performance technologies as related to quality and costs. Design/methodology/approach: Welded joints were made of S960QL steel by employing plasma and GMA hybrid welding by using various welding parameters. The tests were designed so that interrelations between particular welding technologies can be demonstrated. Macroscopic and microscopic examinations as well as hardness and tensile strength tests for welded joints were carried out. Findings: It has been shown that traditional welding methods SAW and GTA can be replaced by PTA-GMA hybrid welding. The obtained welded joints show different geometric features and hardness depending on welding technology used. Research limitations/implications: The description of welded joint structure and mechanical properties was based on welding toughened steels by using an innovative welding method and a filler that has been proposed. Practical implications: The parameters of plasma and GMA hybrid welding for industrial uses were established at the company Teleskop Sp. z o.o. The selected best welding technologies will be subject to welding procedure approval according to PN-EN 15614-1 and implemented into mass production. The information gained from toughened steel welding is an important basis for future research on metallurgical walkability by using high-performance methods of hybrid welding of large-sized structures. Originality/value: The problems associated with welding S960Q steels by using various welding technologies, including the use of an innovative GMA plasma hybrid welding method that is still at the initial stage of research work and there are no original references regarding the suitability of the a/m welding method for large-sized structures made of high-strength toughened steels were established. It has been shown that PTA-GMA hybrid welding has a significant effect on base metal structural changes resulting from a unique nature of combined heat sources of plasma and electric arc.

4

Welding of MART steel with the use of matching fillers

Matkowski P., Nowacki J., Sajek A.

Archives of Materials Science and Engineering

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2014

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Vol. 70, nr 2

77-86

EN

Purpose: This paper attempts to determine the influence of using fillers of various kinds on strength of a welded joint of MART steel depending on the amount of heat supplied. Design/methodology/approach: Test welded joints were made of S1100QL steel with GMAW method, and using different fillers as well as different values of supplied heat. The tests were designed in such a way so as to demonstrate the prospected interdependencies as clearly as possible. Macroscopic examination was carried out, Vickers hardness, impact strength and tensile strength were measured, and technological bend test was conducted on the joint. Findings: Significant differences between the joints obtained resulting from the fillers used and welding parameters applied were noticed. The strength of a joint is lower than that of welded steel, it concentrates in the weld and is similar to the strength of parent material. Research limitations/implications: Conducting research concentrating on welding using particular filler in a wider range of heat supplied would make it possible to obtain more precise results. By delineating the interdependencies between strength parameters, it would be possible to optimise the mechanical properties of welded joints made of MART steels. It would require the employment of automated welding that allows for unrestricted and stable control of parameters. Practical implications: The conditions for making a proper joint of S1100QL steel were determined. Reasons were given for the choice of joint testing methodology and the purposefulness of comprehensive tests of joint parameters. The need for changing test procedures in order to eliminate the causes of inappropriate evaluation was manifested. The influence of automation as an important factor that determines the fulfilment of strict parameter regime of joint formation was emphasised. Determination of the interrelations between mechanical properties of a joint and welding parameters applied would allow to conduct a welding process in such a way so as to obtain a joint of desired usefulness in given technological conditions. Originality/value: Problems associated with welding of S1100QL steel with the use of filler metals of matching materials were defined and possible solutions for these problems were presented. The mechanism of welding thermal cycle influencing structural changes in the joint that result from the complex cycle of hardening and tempering was demonstrated.

5

Komputerowe wspomaganie zarządzania w przedsiębiorstwie górniczym. Część 6. Komputerowe wspomaganie sprzedaży węgla w kopalniach i spółkach węglowych – Kompleks SZYK2/KSP

Rymaszewski S., Matkowski P., Kraska G.

Wiadomości Górnicze

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2013

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R. 64, nr 5

309--318

PL

Kompleks Sprzedaży – KSP w Systemie SZYK2 jest narzędziem wspomagającym procesy sprzedaży węgla oraz kontaktów z klientami. Nowa generacja systemu sprzedaży usprawnia wiele rozwiązań oraz udostępnia nowe w zakresie: planowania i harmonogramowania sprzedaży, centralnego zarządzania sprzedażą, przeniesienia zarządzania magazynami węglowymi do Kompleksu Logistyki Materiałowej SZYK2/KLM, szerszego włączenia klientów w funkcjonalność systemu, wprowadzenia dokumentów elektronicznych z podpisem cyfrowym, uzupełnienia systemu o nowe elementy (zarządzanie klientami, zarządzanie łańcuchem dostaw, systemy nadzoru), wprowadzenia interfejsu graficznego i unowocześnienia technologicznego systemu.

EN

Sales Complex — KSP in SZYK2 system is a tool supporting coal sales processes and relationships with customers. A new generation of sales system improves many solutions, and provides new ones in terms of: planning and sales scheduling, central management of sales, transfer of coal warehouse management to the Materials Logistics Complex SZYK2/KLM, greater involvement of customers in the functionality of the system, the introduction of electronic documents with a digital signature, supplementing of the system with new elements (customers' management, supply chain management, supervision systems), the introduction of the graphical interface and the upgrading of the technological system.

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Badania niezawodności połączeń elektrycznych wykonanych w strukturze LTCC

Matkowski P., Roguszczak H., Golonka L.

Przegląd Elektrotechniczny

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2013

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R. 89, nr 10

115-117

PL

W artykule opisano badania niezawodności elektrycznych połączeń międzywarstwowych w module LTCC (Low Temperature Cofired Ceramics) wykonanym z ceramiki 9K7 firmy DuPont. Otwory (via) w kształcie kołowym wykonano laserem typu Nd-YAG i wypełniono pastą LL601. Ścieżki przewodzące na powierzchni ceramiki wykonano z pasty LL612. Układy wielowarstwowe poddawano cyklom temperaturowym w zakresie od -40°C do 125°C. Przeprowadzony test niezawodności wykazał, iż badane łańcuchy połączeń nie uległy uszkodzeniu w trakcie 300 cykli.

EN

The article describes reliability investigation of electrical connections (vias) in multilayer LTCC (Low Temperature Cofired Ceramics) module. The module is manufactured from ceramics DuPont 9K7. The circular vias are made by Nd-YAG laser. They are filled in with LL601 paste. The surface conductive paths are made from LL612 paste. The reliability test is carried out as the temperature cycles in the range from -40°C to 125°C. The conductive chains exhibit very good reliability. They are not failed in 300 temperature cycles.

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Fatigue strength testing of LTCC and alumina ceramics bonds

Dąbrowski A., Matkowski P., Golonka L.

Materials Science Poland

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2012

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Vol. 30, No. 4

329--334

EN

In this paper the results of fatigue strength tests of ceramic joints are presented. These tests have been performed on the samples subjected to thermal and vibration fatigue as well as on the reference samples without any additional loads. The main goal of the investigation was to determine the strength of hybrid ceramics joints using tensile testing machine. The experiment enabled evaluation of fatigue effects in the mentioned joints. Geometry of test samples has been designed according to FEM simulations, performed in ANSYS FEM environment. Thermal stress as well as the stress induced by vibrations have been analyzed in the designed model. In the experiments two types of ceramics have been used - LTCC green tape DP951 (DuPont) and alumina ceramic tape. The samples have been prepared by joining two sintered ceramic beams made of different types of material. The bonds have been realized utilizing low temperature glass or a layer of LTCC green tape.

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Zastosowanie tomografii komputerowej do oceny jakości mikrostruktur elektronicznych

Matkowski P., Fałat T.

Elektronika : konstrukcje, technologie, zastosowania

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2012

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Vol. 53, nr 2

48-51

PL

Od ponad 40 lat tomografia komputerowa jest z powodzeniem stosowana w medycynie jako technika diagnostyczna. Nieustanny rozwój konstrukcji tomografów i algorytmów rekonstukcyjnych umożliwił zastosowanie tomografów komputerowych w dziedzinie nauk technicznych, między innymi elektroniki. W artykule zostanie zaprezentowany zarys historyczny tomografii, systematyka metod tomograficznych, zasada działania i konstrukcje tomografów oraz przykłady zastosowań tomografu do diagnostyki wybranych mikrostruktur elektronicznych.

EN

Since 40 years computed tomography has been successfully applied in medicine as diagnostic method. Continuous design development of computed tomography (CT) equipment and progress in image reconstruction algorithms enabled application of CT in technical sciences, including electronics. Within the frame of this paper historical outline of computed tomography, systematics of tomographic methods, basic principles and designs of CT equipment, and examples of application of computed tomography in diagnostics of selected electronic microstructures.

9

Uproszczona ocena cyklu życia złączy wykonanych przy zastosowaniu bezołowiowych stopów lutowniczych oraz klejów elektrycznie przewodzących

Friedel K., Matkowski P., Felba J.

Prace Przemysłowego Instytutu Elektroniki

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2006

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nr 153

84-94

PL

Produkty przemysłowe mają ogromny wpływ na zanieczyszczenie środowiska oraz wykorzystanie naturalnych zasobów nie tylko na etapie demontażu i utylizacji, ale także na etapie produkcji i użytkowania. Wiedza dotycząca związków pomiędzy materiałami i produktami każdego procesu jednostkowego na każdym z etapów umożliwia lepsze zrozumienie i redukcję tych wpływów. Jedną z technik wspomagającą takie badania jest uproszczona ocena cyklu życia (ang. Streamlined Life Cycle Assesment SLCA). Uproszczona ocena cyklu życia może być pomocna w identyfikacji możliwości poprawy aspektów środowiskowych wyrobów na każdym etapie ich cyklu życia, podejmowaniu decyzji w przemyśle, wyborze istotnych wskaźników oceny efektów działalności środowiskowej, marketingu i innych. Przedmiotem niniejszych badań jest uproszczona ocena cyklu życia złączy wykonanych przy zastosowaniu bezołowiowych stopów lutowniczych oraz klejów elektrycznie przewodzących. Porównanie takie pomoże ocenić aspekty środowiskowe związane z zastosowaniem powyższych technologii montażu sprzętu elektronicznego.

EN

Industrial products have a great impact on environment pollution and environmental resources utilization not only at dismantling point but also at manufacture and usage points. The knowledge concerning relationships between materials and products of each unit process at each point allows to better comprehend and reduce the impact. One of techniques supporting such investigations is Streamlined Life Cycle Assessment (SLCA). Streamlined Life Cycle Assessment can assist in identifying opportunities to improve environmental aspects of products at each point of life cycle, taking decision in industry, selection of relevant indicators of environmental performance, marketing and others. This study investigates Streamlined Life Cycle Assessment of both lead free solder and electrically conductive adhesive joints. The comparison will help to assess the environmental aspects associated with technology utilization in both cases.

10

Molecular modeling as a novel and promising numerical tool in microelectronics packaging

Matkowski P., Wymysłowski A., Felba J.

Electron Technology : Internet Journal

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2005/2006

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Vol.37/38, nr 14

1-6

EN

Numerical modeling is a widespread tool in microelectronics, which is used generally for support of the prototyping stage. One of the novel numerical tools that are currently emerging is technique based on molecular modeling. Molecular modeling is well known and utilized method in chemistry, biology, medicine, biotechnology, pharmacy and physics. Scientists and researchers have been using molecular modeling to simulate reactions at the molecular levels for many years. Additionally molecular modeling is used in e.g. material modeling. Scientists are interested in material modeling and simulations because of complexity of novel materials. Many novel materials include fillers or particular structure that ensures its mechanical or electrical properties. Molecular modeling and simulations enables to control structure and properties of the materials in the nano-scale. By conducting molecular modeling researchers can obtain proposals of materials that vary in properties by low costs. Molecular modeling also ensures control of processes and prediction possibility. The current paper is focused on possible areas of application of molecular modeling in microelectronic packaging. The paper describes the current state-of-the-art and benefits of molecular modeling to selected problems common in microelectronic packages. Our goal in the future is to apply molecular modeling, as a support tool, to resolve problems that occur in microelectronic packaging as e.g. problem of surface phenomena, thin films, viscoelasticity or mechanical and thermal properties of novel materials and compounds.

11

Skomputeryzowany system wspomagania służb ekspedycyjnych i sprzedaży w górnictwie skalnym

Matkowski P., Rymaszewski S., Syrkiewicz J.

Prace Naukowe Instytutu Górnictwa Politechniki Wrocławskiej. Konferencje

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2002

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Vol. 97, nr 33

147--155

PL

W artykule przedstawiono ogólna konstrukcję budowy oraz zakres funkcjonalny drugiej generacji systemu szyk/sprzedaż przeznaczonego do wspomagania sfery sprzedaży w zakładach sektora górnictwa skalnego

EN

The article presents a general structure and function range of second edition of sales system meant for supporting the services In rock mining plants

12

Skomputeryzowany system wspomagania służb ekspedycji i sprzedaży w górnictwie skalnym

Matkowski P., Rymaszkiewicz S., Syrkiewicz J.

Górnictwo Odkrywkowe

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2001

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R. 43, nr 4

27-35

PL

W artykule przedstawiono ogólną konstrukcję budowy oraz zakres funkcjonalny systemu SZYK / SPRZEDAŻ przeznaczony do wspomagania sfery sprzedaży w zakładach sektora górnictwa skalnego.

EN

The article presents a general structure and and functional range of the order/sales system meant for supporting the sales services in rock mining plants.

13

Simple, low cost quartz crystal monitor system for metal phthalocyanine thin film growth control

Matkowski P., Grządziel L., Szuber J.

Electron Technology

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2000

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Vol. 33, No. 1/2

297-301

EN

In this paper we describe the low cost monitor system, using the quartz crystal microbalance (QCM), for the groeth control of the metal phthalocyanines during deposition under UHV conitions. After short analysis of the theoretical basic of QCM, the detailed description of the elaborated systen is presented, together with its performance in the control of the deposition of the copper phthalocyanine (CuPc) thin films.