The efficiency of a Thermoelectric Module (TEM) is not only influenced by the material properties, but also by the heat losses due to the internal and contact thermal resistances. In the literature, the material properties are mostly discussed, mainly to increase the well-known thermoelectric figure of merit ZT. Nevertheless, when a TEM is considered, the separate characterization of the materials of the p and n elements is not enough to have a suitable TEM electrical model and evaluate more precisely its efficiency. Only a few recent papers deal with thermal resistances and their influence on the TEM efficiency; mostly, the minimization of these resistances is recommended, without giving a way to determine their values. The aim of the present paper is to identify the internal and contact thermal resistances of a TEM by electrical characterization. Depending on the applications, the TEM can be used either under constant temperature gradient or constant heat flow conditions. The proposed identification approach is based on the theoretical electrical modeling of the TEM, in both conditions. It is simple to implement, because it is based only on open circuit test conditions. A single electrical measurement under both conditions (constant-temperature and constant-heat) is needed. Based on the theoretical electrical models, one can identify the internal and thermal resistances.
Mikroelektromechaniczne systemy (MEMS) znajdują szerokie zastosowania w realizacjach układów scalonych na potrzeby współczesnych systemów radiokomunikacyjnych, radiolokacyjnych, GPS itd. Wytwórnie układów scalonych oferują usługi umożliwiające wytwarzanie MEMS i ich integrację z układami scalonymi. Podano informacje o technologii i rodzajach MEMS do zastosowań radiowych i mikrofalowych. Omówiono struktury i modele obwodów zastępczych oraz podano osiągane parametry waraktorów, cewek, przełączników, rezonatorów i linii transmisyjnych realizowanych jako struktury MEMS. Omówiono zastosowania układowe tych elementów.
EN
Micro Electro Mechanical Systems have been widely used in microwave an radio-frequency monolithic integrated circuits for radiocommunications an radar systems. Integrated circuits foundaries offer manufacturing service which allow integration of MEMS structures with electronic circuits on on semiconducor chip. This paper presents basic information and ideas o MEMS technology, electrically different MEMS structures and their applications in RF and microwave circuits and systems. There are presented mechanical structures, electrical models and electrical parameters of MEM: elements which are used as varactors, inductors, switches, resonant circuit and filters, and planar transmission lines at RF and microwave frequencies
JavaScript jest wyłączony w Twojej przeglądarce internetowej. Włącz go, a następnie odśwież stronę, aby móc w pełni z niej korzystać.