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http://yadda.icm.edu.pl:80/baztech/element/bwmeta1.element.baztech-article-BPW7-0012-0088

Czasopismo

Optica Applicata

Tytuł artykułu

Stress modification in gold metal thin films during thermal annealing

Autorzy Prószyński, A.  Chocyk, D.  Gładyszewski, G. 
Treść / Zawartość http://opticaapplicata.pwr.edu.pl/archive.php
Warianty tytułu
Języki publikacji EN
Abstrakty
EN Stress evolution during deposition of 50 nm Au thin films by thermal evaporation in a UHV system and then stress modification during thermal vacuum annealing have been performed. For stress measurement a substrate curvature approach has been applied. The changes in stress versus temperature linked to a modification of microstructure has been interpreted. To obtain any information about structural changes in the film X-ray diffraction measurements has been performed. We can conclude from the measurements that during the first cycle some irreversible structural modifications occur in a metal film.
Słowa kluczowe
EN thin films   annealing   strain   stress  
Wydawca Oficyna Wydawnicza Politechniki Wrocławskiej
Czasopismo Optica Applicata
Rocznik 2009
Tom Vol. 39, nr 4
Strony 705--710
Opis fizyczny bibliogr. 14 poz.,
Twórcy
autor Prószyński, A.
autor Chocyk, D.
autor Gładyszewski, G.
  • Advanced Materials Engineering Research Group, Department of Applied Physics, Lublin University of Technology, Nadbystrzycka 38, 20-618 Lublin, Poland
Bibliografia
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[8] VINCI R.P., ZIELINSKI E.M., BRAVMAN J.C., Thermal strain and stress in copper thin films, Thin Solid Films 262(1–2), 1995, pp. 142–153.
[9] PROSZYNSKI A., Stress modification in thin metal films, PhD Thesis, Łódź University of Technology, Poland 2008 (in Polish).
[10] STONEY G.G., The tension of metallic films deposited by electrolysis, Proceedings of the Royal Society A 82(553), 1909, pp. 172–175.
[12] FLORO J.A., HEARNE S.J., HUNTER J.A., KOTULA P., CHASON E., SEEL S.C., THOMPSON C.V., The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films, Journal of Applied Physics 89(9), 2001, pp. 4886–4897.
[13] FLORO J.A., CHASON E., CAMMARATA R.C., SROLOVITZ D.J., Physical origins of intrinsic stresses in Volmer–Weber thin films, MRS Bulletin 27(1), 2002, pp. 19–25.
[14] CHOCYK D., PROSZYNSKI A., GLADYSZEWSKI G., Diffusional creep induced stress relaxation in thin Cu films on silicon, Microelectronic Engineering 85(10), 2008, pp. 2179–2182.
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