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Acta of Bioengineering and Biomechanics

Tytuł artykułu

Enamel thickness measurement with a high frequency ultrasonic transducer-based hand-held probe for potential application in the dental veneer placing procedure

Autorzy Ślak, B.  Ambroziak, A.  Strumban, E.  Maev, R.Gr. 
Treść / Zawartość
Warianty tytułu
Języki publikacji EN
EN This study presents a novel approach to measure the enamel thickness potentially applicable to the veneer placing procedure. All experiments have been carried out on the extracted human teeth, using a high frequency ultrasonic transducer (50 MHz, Sonix, Springfield, VA, USA). The enamel thickness measurement results obtained with high positional accuracy by a scanning acoustic microscope (Tessonics AM1103, Windsor, ON, Canada) were compared with the measurements conducted in a hand-held mode by using the same transducer placed in a custom fixture. Finally, to validate the ultrasonic measuring results, the samples were cut down the long axis to expose the cross-section. The enamel thickness was measured in several points along the selected part of the exposed cross-section by using an optical microscope (Stemi SV 11, Carl Zeiss AG, Jena, Germany). The values of the enamel thickness received by using the hand-held probe vs. the acoustic microscope were in close proximity (about 10% difference) and were also satisfactory close to the enamel thickness results obtained from the direct cross-sectional measurements (about 12% difference). The authors suggested a measuring procedure that allows avoiding errors related to the ultrasonic beam localization on the tooth surface. The high feasibility of the ultrasonic pulseecho measurements in a hand-held mode was demonstrated.
Słowa kluczowe
PL mikroskopia akustyczna   USG wysokiej częstotliwości   pomiar grubości szkliwa  
EN acoustic microscopy   high frequency ultrasound   enamel thickness measurements  
Wydawca Oficyna Wydawnicza Politechniki Wrocławskiej
Czasopismo Acta of Bioengineering and Biomechanics
Rocznik 2011
Tom Vol. 13, nr 1
Strony 65--70
Opis fizyczny Bibliogr. 21 poz., rys., tab.
autor Ślak, B.
autor Ambroziak, A.
autor Strumban, E.
autor Maev, R.Gr.
  • The Institute for Diagnostic Imaging Research, University of Windsor, Windsor, Ontario, Canada,
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