Narzędzia help

Preferencje help
Widoczny [Schowaj] Abstrakt
Liczba wyników
first previous next last
cannonical link button

http://yadda.icm.edu.pl:80/baztech/element/bwmeta1.element.baztech-article-BAT3-0022-0009

Czasopismo

Journal of Telecommunications and Information Technology

Tytuł artykułu

Trends in assembling of advanced IC packages

Autorzy Kisiel, R.  Szczepański, Z. 
Treść / Zawartość
Warianty tytułu
Języki publikacji EN
Abstrakty
EN In the paper, an overview of the current trends in the development of advanced IC packages will be presented. It will be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) affects the assembly processes of IC and performance of electronic systems. The progress in bonding technologies for semiconductor packages will be presented too. The idea of wire bonding, flip chip and TAB assembly will be shown together with the boundaries imposed by materials and technology. The construction of SiP packages will be explained in more detail. The paper addresses also the latest solutions in MCM packages.
Słowa kluczowe
EN IC packages   SiP   wire bonding   TAB   ip chip  
Wydawca Instytut Łączności - Państwowy Instytut Badawczy
Czasopismo Journal of Telecommunications and Information Technology
Rocznik 2005
Tom nr 1
Strony 63--69
Opis fizyczny bibliogr. 34 poz., tab., il.
Twórcy
autor Kisiel, R.
  • Institute of Micoelectronics and Optoelectronics, Warsaw University of Technology Koszykowa st 75, 00-662 Warsaw, Poland, kisiel@imio.pw.edu.pl
autor Szczepański, Z.
  • Institute of Micoelectronics and Optoelectronics, Warsaw University of Technology Koszykowa st 75, 00-662 Warsaw, Poland, szczepanskiz@imio.pw.edu.pl
Bibliografia
[1] C. Beelen-Hendrikx and M. Verguld, "IC packaging: what's around the corner?", OnBoard Technol., p. 29, Oct. 2002.
[2] J. S. Hwang, Environment-Friendly Electronics: Lead-free Technology. Bristol: Electrochemical Publ., 2001, Chapter 2.
[3] International Technology Roadmap for Semiconductors, 2001 Edition, Assembly and Packaging, http://public.itrs.net
[4] International Technology Roadmap for Semiconductors, 2002 Update, http://public.itrs.net
[5] "Microelectronic packaging-ready for the next product generation", IZM Ann. Rep., p. 45, 2000.
[6] "TAB in volume", Electron. Produc., pp. 17-18, Feb. 1996.
[7] C. E. Presley, "FCA: a critical advantage for designers", Adv. Packag., p. 38{42, Apr. 1999.
[8] C. Beelen, "Trends in assembly processes for miniaturised consumer electronics", Glob. SMT & Packag., vol. 1, no. 1, p. 24-31, 2001.
[9] Z. Szczepański, "Nowe osiągnięcia konstrukcyjne miniaturowych obudów dla układów scalonych dużej skali integracji", Elektronika, no. 7-8, pp. 18-23, 1999 (in Polish).
[10] M. Karnezos, F. Carson, B. Zahn, and T. K. Choi, "Benefits and technical issues of SiP", Glob. SMT & Packag., vol. 1, no. 4, p. 29, 2001.
[11] K. Friedel, "Zaawansowane technologie w monta»u aparatury elektronicznej", Elektronika, vol. XLIII, no. 7-8, pp. 25-27, 2002 (in Polish).
[12] M. Kada and L. Smith, "Advancements is stacked chip scale packaging, provides system-in-a-package functionality for wireless and handheld applications", Jan. 2000, http://www.amkor.com/products
[13] C. M. Scanlan and N. Karim, "System-in-package technology, application and trends", Jan. 2002, http://www.amkor.com
Kolekcja BazTech
Identyfikator YADDA bwmeta1.element.baztech-article-BAT3-0022-0009
Identyfikatory