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Tytuł artykułu

Improving printing process in reflow and thick film technology through analysis and modeling of paste rheology

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Języki publikacji
EN
Abstrakty
EN
In the automotive industry the use of modern technology and provision of the highest quality product and related services is the most important element of rivalry between global corporations and motorcycles. In a competitive struggle for the recognition of its brand in the automotive market, global organizations continuously raise the requirements for quality management systems, so that the finished product meets all the standards in terms of safety and quality and satisfies the ever-growing needs of customers - present and future drivers and passengers of cars. ISO/TS 16949 quality management system is presented in this paper. The framework for customer specific requirement is illustrated as well as prevention of problems.
Rocznik
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11--15
Opis fizyczny
Bibliogr. 22 poz.
Twórcy
autor
  • Budapest University of Technology and Economics Department of Vehicle Elements Vehicle-Structure Analysis, horvath@kge.bme.hu
Bibliografia
  • 1. Anderson R., Maria FG., Kolli V.G. 1995. Solder paste rheology and fine pitch slump. JSMT 1995:12–8.
  • 2. Clyde F. Coombs, JR. 2008. Printed Circuits Hand-book, McGraw-Hill, USA.
  • 3. Durairaj R., Ramesh S., Mallik S. 2009. Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes, Materials and Design 30 3812–3818.
  • 4. Durairaj, R., Mallik, S. and Ekere, N.N. 2008. Solder paste characterisation: towards the development of quality control tool, Soldering & Surface Mount Technology, Vol. 20, No. 3, pp. 34-40.
  • 5. Durairaj, S., Mallik, A., Seman, A., Marks, N.N. Ekere 2009. Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly, Journal of Materials Processing Technology 209, 3923-3930.
  • 6. Ficzere P., Borbás L.., Török Á. 2013. Economical Investigation Of Rapid Prototyping, International Journal For Traffic And Transport Engineering 3:(3):344-350., Doi: 10.7708/Ijtte.2013.3(3).09.
  • 7. Holzapfel, G. 2000. Nonlinear Solid Mechanics: A Continuum Approach for Engineering Wiley; Cichester.
  • 8. Horváth E. 2008. Embedded Thick-Film Resistors Applied in Low Temperature Co-fired Ceramic Circuit Substrates, Periodica Polytechnica: Electrical Engineering 52: (1-2) pp. 45-57.
  • 9. Jeong J., Kim M., 1985. Slow viscous flow due to sliding of a semi-infinite plate over a plane, Journal of Physics Society, 54, 1789-1799.
  • 10. Krammer O. 2014. Finite Volume Modelling of Stencil Printing Process, 20th International Symposium for Dsign and Technology in Electronic Packaging (SIITME) pp. 79-82.
  • 11. Krynke M., Borkowski S., Selejdak J. 2014. Analysis of influence of bearing clearance on the static carrying capacity of multi-row slewing bearings, Periodica Polytechnika Transport Engineering, 42(1):43-48, 2014, doi: 10.3311/PPtr.7261Lubliner, J. (1990): Plasticity Theory, Macmillan, New York.
  • 12. Markovits T., Bauernhuber A., Mikula P. 2013. Study on the transparency of polymer materials in case of Nd:YAG laser radiation, Periodica Polytechnika Transportation Engineering, 41(2):149–154, doi: 10.3311/PPtr.7117.
  • 13. Maugin G.A. 1992. The Thermodynamics of Plasticity and Fracture, Cambridge Univ. Press. Cambridge.
  • 14. Riedler J., 1983. Viscous flow in corner regions with a moving wall and leakage of fluid, Acta Mechanica, 48, 95-102.
  • 15. Riemer D.E., 1988A. Analytical model of the screen printing process: part 1, Solid State Technology,8, 107-111.
  • 16. Riemer D.E., 1988B. Analytical model of the screen printing process: part 2, Solid State Technology, 9, 85-90.
  • 17. Seo, W.S., Min, B.W., Kim, J.H., Lee, N.K. and Kim, J.B. 2010. An analysis of screen printing using solder paste, J. Microelectron. Packag. Soc., Vol. 17 No. 1, pp. 47-53.
  • 18. Tapan G. 2003. Handbook of Thick and Thin-Film Hybrid Microelectronics. Hoboken, N.J: Wiley-Interscience.
  • 19. Taylor g.I., 1962. On scraping viscous fluid from a plane surface, Miszallangen Angewandten Mechanik, 313-315.
  • 20. Tsai T.-N. 2011. Improving the fine-pitch stencil print-ing capability using the Taguchi method and Taguchi fuzzy-based model, Robotics and Computer-Integrated Manufacturing 27808–817.
  • 21. White G.S., Breward C.J.W., Howell P.D. 2006. A model for the screen-printing of Newtonian fluids, Journal of Engineering Mathematics, 54, 49-70.
  • 22. Yen Y.-T., Fang T.-H., Lin Y.-C. 2011. Optimization of screen-printing parameters of SN9000 ink for pinholes using Taguchi method in chip on film packaging, Robotics and Computer-Integrated Manufacturing 27 531–537.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-30940484-42d8-4732-887d-5d52aa19eeb8
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